nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A mid-value select voter
|
Krstic, M.D. |
|
2005 |
45 |
3-4 |
p. 733-738 6 p. |
artikel |
2 |
Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile
|
Cortés, I. |
|
2005 |
45 |
3-4 |
p. 493-498 6 p. |
artikel |
3 |
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
|
Vanstreels, K. |
|
2005 |
45 |
3-4 |
p. 753-759 7 p. |
artikel |
4 |
A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup
|
Voldman, Steven H. |
|
2005 |
45 |
3-4 |
p. 437-455 19 p. |
artikel |
5 |
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
|
Tsang, C.F. |
|
2005 |
45 |
3-4 |
p. 517-525 9 p. |
artikel |
6 |
Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications
|
Radovanović, Saša |
|
2005 |
45 |
3-4 |
p. 705-710 6 p. |
artikel |
7 |
Bipolar SCR ESD devices
|
Vashchenko, V.A. |
|
2005 |
45 |
3-4 |
p. 457-471 15 p. |
artikel |
8 |
Characterization of bump arrays at RF/microwave frequencies
|
Ndip, Ivan N. |
|
2005 |
45 |
3-4 |
p. 551-558 8 p. |
artikel |
9 |
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry
|
Joo, Jinwon |
|
2005 |
45 |
3-4 |
p. 637-646 10 p. |
artikel |
10 |
Chemical and diffusion-controlled curing kinetics of an underfill material
|
He, Yi |
|
2005 |
45 |
3-4 |
p. 689-695 7 p. |
artikel |
11 |
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides
|
Suehle, J.S. |
|
2005 |
45 |
3-4 |
p. 419-426 8 p. |
artikel |
12 |
Electrothermal characterization of silicon-on-glass VDMOSFETs
|
Nenadović, N. |
|
2005 |
45 |
3-4 |
p. 541-550 10 p. |
artikel |
13 |
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
|
Waris, Tuomas F. |
|
2005 |
45 |
3-4 |
p. 665-673 9 p. |
artikel |
14 |
Evaluation of parasitic capacitances for interconnection buses crossing in different layers
|
Jarosz, A. |
|
2005 |
45 |
3-4 |
p. 761-765 5 p. |
artikel |
15 |
Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation
|
Lim, Ji-hyuk |
|
2005 |
45 |
3-4 |
p. 473-478 6 p. |
artikel |
16 |
Flip chip attachment on flexible LCP substrate using an ACF
|
Frisk, L. |
|
2005 |
45 |
3-4 |
p. 583-588 6 p. |
artikel |
17 |
Gate dielectric breakdown in the time-scale of ESD events
|
Weir, Bonnie E. |
|
2005 |
45 |
3-4 |
p. 427-436 10 p. |
artikel |
18 |
Hybrid reliability assessment for packaging prototyping
|
Lu, Hua |
|
2005 |
45 |
3-4 |
p. 597-609 13 p. |
artikel |
19 |
Impact of gate-leakage currents on CMOS circuit performance
|
Marras, Alessandro |
|
2005 |
45 |
3-4 |
p. 499-506 8 p. |
artikel |
20 |
Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies
|
Goguenheim, D. |
|
2005 |
45 |
3-4 |
p. 487-492 6 p. |
artikel |
21 |
Improving reliability of beveled power semiconductor devices passivated by SIPOS
|
Wang, Ying |
|
2005 |
45 |
3-4 |
p. 535-539 5 p. |
artikel |
22 |
Intermediate wafer level bonding and interface behavior
|
Pan, C.T. |
|
2005 |
45 |
3-4 |
p. 657-663 7 p. |
artikel |
23 |
Low voltage SILC and P- and N-MOSFET gate oxide reliability
|
Petit, C. |
|
2005 |
45 |
3-4 |
p. 479-485 7 p. |
artikel |
24 |
Measuring process capability based on C PK with gauge measurement errors
|
Pearn, W.L. |
|
2005 |
45 |
3-4 |
p. 739-751 13 p. |
artikel |
25 |
Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique
|
Islam, T. |
|
2005 |
45 |
3-4 |
p. 697-703 7 p. |
artikel |
26 |
MOS current divider based PGA
|
Sanz, M. Teresa |
|
2005 |
45 |
3-4 |
p. 727-732 6 p. |
artikel |
27 |
100 μm Pitch flip chip on foil assemblies with adhesive interconnections
|
de Vries, J. |
|
2005 |
45 |
3-4 |
p. 527-534 8 p. |
artikel |
28 |
Novel concepts for reliability technology
|
Ryu, Dongsu |
|
2005 |
45 |
3-4 |
p. 611-622 12 p. |
artikel |
29 |
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
|
Siau, Sam |
|
2005 |
45 |
3-4 |
p. 675-687 13 p. |
artikel |
30 |
Response surface models for efficient, modular estimation of solder joint reliability in area array packages
|
Zhang, L. |
|
2005 |
45 |
3-4 |
p. 623-635 13 p. |
artikel |
31 |
Review of add-on process modules for high-frequency silicon technology
|
Burghartz, J.N. |
|
2005 |
45 |
3-4 |
p. 409-418 10 p. |
artikel |
32 |
SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects
|
Murthy, Ramana |
|
2005 |
45 |
3-4 |
p. 507-516 10 p. |
artikel |
33 |
Study of anisotropic conductive adhesive joint behavior under 3-point bending
|
Rizvi, M.J. |
|
2005 |
45 |
3-4 |
p. 589-596 8 p. |
artikel |
34 |
Systematic evaluation of thermal interface materials—a case study in high power amplifier design
|
Maguire, Luke |
|
2005 |
45 |
3-4 |
p. 711-725 15 p. |
artikel |
35 |
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces
|
Kim, K.S. |
|
2005 |
45 |
3-4 |
p. 647-655 9 p. |
artikel |
36 |
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E
|
Tao, Yi |
|
2005 |
45 |
3-4 |
p. 559-566 8 p. |
artikel |
37 |
Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs
|
Shimoto, Tadanori |
|
2005 |
45 |
3-4 |
p. 567-574 8 p. |
artikel |
38 |
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly
|
Lai, Yi-Shao |
|
2005 |
45 |
3-4 |
p. 575-582 8 p. |
artikel |