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Journal description
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Details for article 35 of 38 found articles
| Title: |
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces |
| Author: |
Kim, K.S. Ryu, K.W. Yu, C.H. Kim, J.M. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 45 (2005) nr. 3-4 pages 9 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 38 found articles
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