Digital Library
Close Browse articles from a journal
 
Search for with title:
ABCDEFGHIJKLMNOPQRSTUVWXYZ

     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
                                       All articles of the corresponding issues
 
                             38 results found
no title author magazine year volume issue page(s) type
1 A mid-value select voter Krstic, M.D.
 2005
 45 3-4 p. 733-738
6 p.
 article
2 Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile Cortés, I.
 2005
 45 3-4 p. 493-498
6 p.
 article
3 A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure Vanstreels, K.
 2005
 45 3-4 p. 753-759
7 p.
 article
4 A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup Voldman, Steven H.
 2005
 45 3-4 p. 437-455
19 p.
 article
5 A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections Tsang, C.F.
 2005
 45 3-4 p. 517-525
9 p.
 article
6 Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications Radovanović, Saša
 2005
 45 3-4 p. 705-710
6 p.
 article
7 Bipolar SCR ESD devices Vashchenko, V.A.
 2005
 45 3-4 p. 457-471
15 p.
 article
8 Characterization of bump arrays at RF/microwave frequencies Ndip, Ivan N.
 2005
 45 3-4 p. 551-558
8 p.
 article
9 Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry Joo, Jinwon
 2005
 45 3-4 p. 637-646
10 p.
 article
10 Chemical and diffusion-controlled curing kinetics of an underfill material He, Yi
 2005
 45 3-4 p. 689-695
7 p.
 article
11 Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides Suehle, J.S.
 2005
 45 3-4 p. 419-426
8 p.
 article
12 Electrothermal characterization of silicon-on-glass VDMOSFETs Nenadović, N.
 2005
 45 3-4 p. 541-550
10 p.
 article
13 Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate Waris, Tuomas F.
 2005
 45 3-4 p. 665-673
9 p.
 article
14 Evaluation of parasitic capacitances for interconnection buses crossing in different layers Jarosz, A.
 2005
 45 3-4 p. 761-765
5 p.
 article
15 Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation Lim, Ji-hyuk
 2005
 45 3-4 p. 473-478
6 p.
 article
16 Flip chip attachment on flexible LCP substrate using an ACF Frisk, L.
 2005
 45 3-4 p. 583-588
6 p.
 article
17 Gate dielectric breakdown in the time-scale of ESD events Weir, Bonnie E.
 2005
 45 3-4 p. 427-436
10 p.
 article
18 Hybrid reliability assessment for packaging prototyping Lu, Hua
 2005
 45 3-4 p. 597-609
13 p.
 article
19 Impact of gate-leakage currents on CMOS circuit performance Marras, Alessandro
 2005
 45 3-4 p. 499-506
8 p.
 article
20 Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies Goguenheim, D.
 2005
 45 3-4 p. 487-492
6 p.
 article
21 Improving reliability of beveled power semiconductor devices passivated by SIPOS Wang, Ying
 2005
 45 3-4 p. 535-539
5 p.
 article
22 Intermediate wafer level bonding and interface behavior Pan, C.T.
 2005
 45 3-4 p. 657-663
7 p.
 article
23 Low voltage SILC and P- and N-MOSFET gate oxide reliability Petit, C.
 2005
 45 3-4 p. 479-485
7 p.
 article
24 Measuring process capability based on C PK with gauge measurement errors Pearn, W.L.
 2005
 45 3-4 p. 739-751
13 p.
 article
25 Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique Islam, T.
 2005
 45 3-4 p. 697-703
7 p.
 article
26 MOS current divider based PGA Sanz, M. Teresa
 2005
 45 3-4 p. 727-732
6 p.
 article
27 100 μm Pitch flip chip on foil assemblies with adhesive interconnections de Vries, J.
 2005
 45 3-4 p. 527-534
8 p.
 article
28 Novel concepts for reliability technology Ryu, Dongsu
 2005
 45 3-4 p. 611-622
12 p.
 article
29 Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards Siau, Sam
 2005
 45 3-4 p. 675-687
13 p.
 article
30 Response surface models for efficient, modular estimation of solder joint reliability in area array packages Zhang, L.
 2005
 45 3-4 p. 623-635
13 p.
 article
31 Review of add-on process modules for high-frequency silicon technology Burghartz, J.N.
 2005
 45 3-4 p. 409-418
10 p.
 article
32 SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects Murthy, Ramana
 2005
 45 3-4 p. 507-516
10 p.
 article
33 Study of anisotropic conductive adhesive joint behavior under 3-point bending Rizvi, M.J.
 2005
 45 3-4 p. 589-596
8 p.
 article
34 Systematic evaluation of thermal interface materials—a case study in high power amplifier design Maguire, Luke
 2005
 45 3-4 p. 711-725
15 p.
 article
35 The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces Kim, K.S.
 2005
 45 3-4 p. 647-655
9 p.
 article
36 Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Tao, Yi
 2005
 45 3-4 p. 559-566
8 p.
 article
37 Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs Shimoto, Tadanori
 2005
 45 3-4 p. 567-574
8 p.
 article
38 Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Lai, Yi-Shao
 2005
 45 3-4 p. 575-582
8 p.
 article
                             38 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands