| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Al surface morphology effect on flip-chip solder bump shear strength
|
Wai Ching Yau, Esther
|
|
2004
|
44 |
2 |
p. 323-331
9 p.
|
artikel
|
| 2 |
An introduction to Cu electromigration
|
Hau-Riege, Christine S.
|
|
2004
|
44 |
2 |
p. 195-205
11 p.
|
artikel
|
| 3 |
Behavior of Cu(In,Ga)Se2 solar cells under light/damp heat over time
|
Yanagisawa, Takeshi
|
|
2004
|
44 |
2 |
p. 229-235
7 p.
|
artikel
|
| 4 |
Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress
|
Lee, Yi-Mu
|
|
2004
|
44 |
2 |
p. 207-212
6 p.
|
artikel
|
| 5 |
Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip
|
Carrasco, Juan A.
|
|
2004
|
44 |
2 |
p. 339-350
12 p.
|
artikel
|
| 6 |
Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments
|
Dąbrowski, W.
|
|
2004
|
44 |
2 |
p. 351-361
11 p.
|
artikel
|
| 7 |
Design optimization of ESD protection and latchup prevention for a serial I/O IC
|
Huang, Chih-Yao
|
|
2004
|
44 |
2 |
p. 213-221
9 p.
|
artikel
|
| 8 |
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
|
Wu, Y.P.
|
|
2004
|
44 |
2 |
p. 295-302
8 p.
|
artikel
|
| 9 |
Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon
|
Moon, Seok Hwan
|
|
2004
|
44 |
2 |
p. 315-321
7 p.
|
artikel
|
| 10 |
Fabrication of suspended thin film resonator for application of RF bandpass filter
|
Kim, Hyun Ho
|
|
2004
|
44 |
2 |
p. 237-243
7 p.
|
artikel
|
| 11 |
Interconnecting and Computing over Satellite Networks; Yongguang Zhang (Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 262, plus XXII, 128€. ISBN 1-4020-7424-7
|
Stojcev, Mile
|
|
2004
|
44 |
2 |
p. 363-364
2 p.
|
artikel
|
| 12 |
Load characterization during transportation
|
Ramakrishnan, Arun
|
|
2004
|
44 |
2 |
p. 333-338
6 p.
|
artikel
|
| 13 |
Long time reliability study of soldered flip chips on flexible substrates
|
Pahl, Barbara
|
|
2004
|
44 |
2 |
p. 309-314
6 p.
|
artikel
|
| 14 |
Materials characterization of the effect of mechanical bending on area array package interconnects
|
Rooney, Daniel T
|
|
2004
|
44 |
2 |
p. 275-285
11 p.
|
artikel
|
| 15 |
Modeling of the spectral response of PIN photodetectors Impact of exposed zone thickness, surface recombination velocity and trap concentration
|
Bouhdada, A
|
|
2004
|
44 |
2 |
p. 223-228
6 p.
|
artikel
|
| 16 |
Reliability characteristics of high-k dielectrics
|
Kim, Young-Hee
|
|
2004
|
44 |
2 |
p. 183-193
11 p.
|
artikel
|
| 17 |
Reliability testing of flexible printed circuit-based RF MEMS capacitive switches
|
Lee, Simone
|
|
2004
|
44 |
2 |
p. 245-250
6 p.
|
artikel
|
| 18 |
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems
|
Tao, Yi
|
|
2004
|
44 |
2 |
p. 251-258
8 p.
|
artikel
|
| 19 |
Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation
|
Shohji, Ikuo
|
|
2004
|
44 |
2 |
p. 269-274
6 p.
|
artikel
|
| 20 |
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages
|
Goh, Jason Y.L.
|
|
2004
|
44 |
2 |
p. 259-267
9 p.
|
artikel
|
| 21 |
Thermal properties of diamond/copper composite material
|
Yoshida, Katsuhito
|
|
2004
|
44 |
2 |
p. 303-308
6 p.
|
artikel
|
| 22 |
Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications
|
Lopez, Cristina
|
|
2004
|
44 |
2 |
p. 287-294
8 p.
|
artikel
|
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