|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 20 of 22 found articles
| Title: |
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages |
| Author: |
Goh, Jason Y.L. Pitter, Mark C. See, Chung W. Somekh, Michael G. Vanderstraeten, Daniel |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 44 (2004) nr. 2 pages 9 p. |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 20 of 22 found articles
| << previous | next >> |