| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages
|
Dauksher, W.
|
|
2003
|
43 |
12 |
p. 2011-2020
10 p.
|
artikel
|
| 2 |
Author Index to Volume 42
|
|
|
2003
|
43 |
12 |
p. 2113-2119
7 p.
|
artikel
|
| 3 |
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy
|
Islam, M.N
|
|
2003
|
43 |
12 |
p. 2031-2037
7 p.
|
artikel
|
| 4 |
Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses
|
Cao, X.A.
|
|
2003
|
43 |
12 |
p. 1987-1991
5 p.
|
artikel
|
| 5 |
Effect of voids on the reliability of BGA/CSP solder joints
|
Yunus, Mohammad
|
|
2003
|
43 |
12 |
p. 2077-2086
10 p.
|
artikel
|
| 6 |
Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators
|
Roh, Y.S.
|
|
2003
|
43 |
12 |
p. 1993-2000
8 p.
|
artikel
|
| 7 |
Improving the deflection of wire bonds in stacked chip scale package (CSP)
|
Yao, Y.F.
|
|
2003
|
43 |
12 |
p. 2039-2045
7 p.
|
artikel
|
| 8 |
Issues in accelerated electromigration of solder bumps
|
Rinne, Glenn A.
|
|
2003
|
43 |
12 |
p. 1975-1980
6 p.
|
artikel
|
| 9 |
Measurement of high electrical current density effects in solder joints
|
Ye, Hua
|
|
2003
|
43 |
12 |
p. 2021-2029
9 p.
|
artikel
|
| 10 |
Moisture absorption and diffusion characterisation of packaging materials––advanced treatment
|
Wong, E.H.
|
|
2003
|
43 |
12 |
p. 2087-2096
10 p.
|
artikel
|
| 11 |
Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology––double-sided CSP and single-sided CSP
|
Nishida, Kazuto
|
|
2003
|
43 |
12 |
p. 2065-2075
11 p.
|
artikel
|
| 12 |
Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna
|
Tsai, Han-Chang
|
|
2003
|
43 |
12 |
p. 2001-2009
9 p.
|
artikel
|
| 13 |
The effect of small-signal AC voltages on C–V characterization and parameter extraction of SiO2 thin films
|
Zhang, Hongguo
|
|
2003
|
43 |
12 |
p. 1981-1985
5 p.
|
artikel
|
| 14 |
Thermally driven reliability issues in microelectronic systems: status-quo and challenges
|
Lasance, Clemens J.M.
|
|
2003
|
43 |
12 |
p. 1969-1974
6 p.
|
artikel
|
| 15 |
The study on failure mechanisms of bond pad metal peeling: Part A––Experimental investigation
|
Jeon, Insu
|
|
2003
|
43 |
12 |
p. 2047-2054
8 p.
|
artikel
|
| 16 |
The study on failure mechanisms of bond pad metal peeling: Part B––Numerical analysis
|
Jeon, Insu
|
|
2003
|
43 |
12 |
p. 2055-2064
10 p.
|
artikel
|
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