nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Analysis of thermal stresses in metal interconnects with multilevel structures
|
Kilijanski, M.S. |
|
2002 |
42 |
2 |
p. 259-264 6 p. |
artikel |
2 |
Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs
|
Atanassova, E. |
|
2002 |
42 |
2 |
p. 157-173 17 p. |
artikel |
3 |
Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method
|
Yanagisawa, Takeshi |
|
2002 |
42 |
2 |
p. 219-223 5 p. |
artikel |
4 |
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
|
Ito, Shinya |
|
2002 |
42 |
2 |
p. 201-209 9 p. |
artikel |
5 |
1/f γ Noise separated from white noise with wavelet denoising
|
Du, Lei |
|
2002 |
42 |
2 |
p. 183-188 6 p. |
artikel |
6 |
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
|
Strandjord, Andrew J.G |
|
2002 |
42 |
2 |
p. 265-283 19 p. |
artikel |
7 |
Methodology for predicting solder joint reliability in semiconductor packages
|
Pendse, Rajendra D |
|
2002 |
42 |
2 |
p. 301-305 5 p. |
artikel |
8 |
On discrete random dopant modeling in drift-diffusion simulations: physical meaning of `atomistic' dopants
|
Sano, Nobuyuki |
|
2002 |
42 |
2 |
p. 189-199 11 p. |
artikel |
9 |
Power capability limits of power MOSFET devices
|
Chung, Young S |
|
2002 |
42 |
2 |
p. 211-218 8 p. |
artikel |
10 |
Reliability of via-in-pad structures in mechanical cycling fatigue
|
Jonnalagadda, K |
|
2002 |
42 |
2 |
p. 253-258 6 p. |
artikel |
11 |
The effect of transition region on the direct tunneling current and Fowler–Nordheim tunneling current oscillations in ultrathin MOS structures
|
Mao, Lingfeng |
|
2002 |
42 |
2 |
p. 175-181 7 p. |
artikel |
12 |
The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD diamond plastic packages
|
Fabis, Philip M |
|
2002 |
42 |
2 |
p. 233-252 20 p. |
artikel |
13 |
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
|
Wang, Jinlin |
|
2002 |
42 |
2 |
p. 293-299 7 p. |
artikel |
14 |
Use of scanning capacitance microscopy for controlling wafer processing
|
Jeandupeux, O |
|
2002 |
42 |
2 |
p. 225-231 7 p. |
artikel |
15 |
Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor
|
Lo, Yu-Lung |
|
2002 |
42 |
2 |
p. 285-291 7 p. |
artikel |