Digital Library
Close Browse articles from a journal
 
<< previous    next >>
     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
           All articles of the corresponding issues
                                       Details for article 13 of 15 found articles
 
 
  Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
 
 
Title: Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
Author: Wang, Jinlin
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 2 pages 7 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 15 found articles
 
<< previous    next >>
 
 Koninklijke Bibliotheek - National Library of the Netherlands