| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Analysis of thermal stresses in metal interconnects with multilevel structures
|
Kilijanski, M.S.
|
|
2002
|
42 |
2 |
p. 259-264
6 p.
|
article
|
| 2 |
Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs
|
Atanassova, E.
|
|
2002
|
42 |
2 |
p. 157-173
17 p.
|
article
|
| 3 |
Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method
|
Yanagisawa, Takeshi
|
|
2002
|
42 |
2 |
p. 219-223
5 p.
|
article
|
| 4 |
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
|
Ito, Shinya
|
|
2002
|
42 |
2 |
p. 201-209
9 p.
|
article
|
| 5 |
1/f γ Noise separated from white noise with wavelet denoising
|
Du, Lei
|
|
2002
|
42 |
2 |
p. 183-188
6 p.
|
article
|
| 6 |
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
|
Strandjord, Andrew J.G
|
|
2002
|
42 |
2 |
p. 265-283
19 p.
|
article
|
| 7 |
Methodology for predicting solder joint reliability in semiconductor packages
|
Pendse, Rajendra D
|
|
2002
|
42 |
2 |
p. 301-305
5 p.
|
article
|
| 8 |
On discrete random dopant modeling in drift-diffusion simulations: physical meaning of `atomistic' dopants
|
Sano, Nobuyuki
|
|
2002
|
42 |
2 |
p. 189-199
11 p.
|
article
|
| 9 |
Power capability limits of power MOSFET devices
|
Chung, Young S
|
|
2002
|
42 |
2 |
p. 211-218
8 p.
|
article
|
| 10 |
Reliability of via-in-pad structures in mechanical cycling fatigue
|
Jonnalagadda, K
|
|
2002
|
42 |
2 |
p. 253-258
6 p.
|
article
|
| 11 |
The effect of transition region on the direct tunneling current and Fowler–Nordheim tunneling current oscillations in ultrathin MOS structures
|
Mao, Lingfeng
|
|
2002
|
42 |
2 |
p. 175-181
7 p.
|
article
|
| 12 |
The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD diamond plastic packages
|
Fabis, Philip M
|
|
2002
|
42 |
2 |
p. 233-252
20 p.
|
article
|
| 13 |
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
|
Wang, Jinlin
|
|
2002
|
42 |
2 |
p. 293-299
7 p.
|
article
|
| 14 |
Use of scanning capacitance microscopy for controlling wafer processing
|
Jeandupeux, O
|
|
2002
|
42 |
2 |
p. 225-231
7 p.
|
article
|
| 15 |
Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor
|
Lo, Yu-Lung
|
|
2002
|
42 |
2 |
p. 285-291
7 p.
|
article
|
Journal description