| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A 0.11 μm CMOS technology featuring copper and very low k interconnects with high performance and reliability
|
Takao, Yoshihiro
|
|
2002
|
42 |
1 |
p. 15-25
11 p.
|
article
|
| 2 |
Application of forward gated-diode R–G current method in extracting F–N stress-induced interface traps in SOI NMOSFETs
|
He, Jin
|
|
2002
|
42 |
1 |
p. 145-148
4 p.
|
article
|
| 3 |
A reliability of different metal contacts with amorphous carbon
|
Paul, S
|
|
2002
|
42 |
1 |
p. 141-143
3 p.
|
article
|
| 4 |
A simple method for evaluating the transient thermal response of semiconductor devices
|
Shammas, N.Y.A
|
|
2002
|
42 |
1 |
p. 109-117
9 p.
|
article
|
| 5 |
Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs
|
Suemitsu, Tetsuya
|
|
2002
|
42 |
1 |
p. 47-52
6 p.
|
article
|
| 6 |
Calendar
|
|
|
2002
|
42 |
1 |
p. I-VII
nvt p.
|
article
|
| 7 |
Characterization of solder interfaces using laser flash metrology
|
Chiu, Chia-Pin
|
|
2002
|
42 |
1 |
p. 93-100
8 p.
|
article
|
| 8 |
Effect of the drop impact on BGA/CSP package reliability
|
Mishiro, Kinuko
|
|
2002
|
42 |
1 |
p. 77-82
6 p.
|
article
|
| 9 |
High-electric-field effects and degradation of AlGaAs/GaAs power HFETs: a numerical study
|
Sozzi, Giovanna
|
|
2002
|
42 |
1 |
p. 53-59
7 p.
|
article
|
| 10 |
Improving thermal performance of miniature heat pipe for notebook PC cooling
|
Moon, Seok Hwan
|
|
2002
|
42 |
1 |
p. 135-140
6 p.
|
article
|
| 11 |
Influence of test techniques on soft breakdown detection in ultra-thin oxides
|
Brisbin, Douglas
|
|
2002
|
42 |
1 |
p. 35-39
5 p.
|
article
|
| 12 |
Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system
|
Yuan, Tsorng-Dih
|
|
2002
|
42 |
1 |
p. 101-108
8 p.
|
article
|
| 13 |
[No title]
|
|
|
2002
|
42 |
1 |
p. 1-
1 p.
|
article
|
| 14 |
Novel design of driver and ESD transistors with significantly reduced silicon area
|
Verhaege, Koen G
|
|
2002
|
42 |
1 |
p. 3-13
11 p.
|
article
|
| 15 |
Precise spice macromodel applied to high-voltage power MOSFET
|
Lomeli, F.S
|
|
2002
|
42 |
1 |
p. 149-152
4 p.
|
article
|
| 16 |
Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors
|
Quintero, Rodolfo
|
|
2002
|
42 |
1 |
p. 67-76
10 p.
|
article
|
| 17 |
Reduction of self-heating effect on SOIM devices
|
Roig, J
|
|
2002
|
42 |
1 |
p. 61-66
6 p.
|
article
|
| 18 |
Reliability and routability consideration for MCM placement
|
Huang, Yu-Jung
|
|
2002
|
42 |
1 |
p. 83-91
9 p.
|
article
|
| 19 |
Reliability improvement of fluorescent lamp using grey forecasting model
|
Chiao, C.-H.
|
|
2002
|
42 |
1 |
p. 127-134
8 p.
|
article
|
| 20 |
Static and low frequency noise characterization of surface- and buried-mode 0.1 μm P and N MOSFETs
|
Fadlallah, M
|
|
2002
|
42 |
1 |
p. 41-46
6 p.
|
article
|
| 21 |
The correlation between the low-frequency electrical noise of high-power quantum well lasers and devices surface non-radiative current
|
Guijun, Hu
|
|
2002
|
42 |
1 |
p. 153-156
4 p.
|
article
|
| 22 |
The effects of curing parameters on the properties development of an epoxy encapsulant material
|
Naito, Christine
|
|
2002
|
42 |
1 |
p. 119-125
7 p.
|
article
|
| 23 |
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
|
Zhao, Jie-Hua
|
|
2002
|
42 |
1 |
p. 27-34
8 p.
|
article
|
Journal description