| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparative analysis of printed circuit drying methods for the reliability of assembly process
|
Ciszewski, Piotr
|
|
|
129 |
C |
p.
|
artikel
|
| 2 |
A cost-effective repair scheme for clustered TSV defects in 3D ICs
|
Maity, Dilip Kumar
|
|
|
129 |
C |
p.
|
artikel
|
| 3 |
Analysis of radiation effect of a novel SOI-Like LDMOS structure
|
Yang, Yang
|
|
|
129 |
C |
p.
|
artikel
|
| 4 |
Analysis on damage and failure behavior of printed silver wires under high-density current loading
|
Sun, Quan
|
|
|
129 |
C |
p.
|
artikel
|
| 5 |
Development of solderable layer on power MOSFET for double-side bonding
|
Kim, Dajung
|
|
|
129 |
C |
p.
|
artikel
|
| 6 |
Editorial Board
|
|
|
|
129 |
C |
p.
|
artikel
|
| 7 |
Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad
|
Kim, Jungsoo
|
|
|
129 |
C |
p.
|
artikel
|
| 8 |
Electro-thermal coupling and performance estimation of LEDs at system level
|
Meng, Haotian
|
|
|
129 |
C |
p.
|
artikel
|
| 9 |
Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint
|
Bai, Tianyue
|
|
|
129 |
C |
p.
|
artikel
|
| 10 |
Gate-oxide-short defect analysis and fault modeling in FinFETs
|
Dibaj, Roya
|
|
|
129 |
C |
p.
|
artikel
|
| 11 |
Highly reliable CuCu low temperature bonding using SAC305 solder with rGO interlayer
|
Yin, Xiang
|
|
|
129 |
C |
p.
|
artikel
|
| 12 |
Impact of multi-finger MOSFET geometry on the electrical performance of RF circuits
|
Saad, Sehmi
|
|
|
129 |
C |
p.
|
artikel
|
| 13 |
Influence of the size and the material of the magnetic core on thermal properties of the inductor
|
Detka, Kalina
|
|
|
129 |
C |
p.
|
artikel
|
| 14 |
Inkjet-printed HF antenna made on PET substrate
|
Tomaszewski, Grzegorz
|
|
|
129 |
C |
p.
|
artikel
|
| 15 |
In-situ temperature-dependent characterization of copper through glass via (TGV)
|
Pan, Ke
|
|
|
129 |
C |
p.
|
artikel
|
| 16 |
Novel ESD device design for STT-MRAM memory chip
|
Zhang, Guangjun
|
|
|
129 |
C |
p.
|
artikel
|
| 17 |
Novel testability modelling and diagnosis method considering the supporting relation between faults and tests
|
Shi, Junyou
|
|
|
129 |
C |
p.
|
artikel
|
| 18 |
Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework
|
Huang, Pei-Chen
|
|
|
129 |
C |
p.
|
artikel
|
| 19 |
Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks
|
Zippelius, Andreas
|
|
|
129 |
C |
p.
|
artikel
|
| 20 |
Reliability of LED-based systems
|
van Driel, Willem D.
|
|
|
129 |
C |
p.
|
artikel
|
| 21 |
Research of single event burnout in a high-performance radiation-hardened SOI lateral power MOSFET
|
Wang, Yue
|
|
|
129 |
C |
p.
|
artikel
|
| 22 |
Single Event Transient tolerant Count Min Sketches
|
Zhu, Jinhua
|
|
|
129 |
C |
p.
|
artikel
|
Tijdschrift beschrijving