| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A hybrid system-level prognostics approach with online RUL forecasting for electronics-rich systems with unknown degradation behaviors
|
Al-Mohamad, Ahmad
|
|
|
111 |
C |
p.
|
artikel
|
| 2 |
Analysis and modeling of quantization error in spike-frequency-based image sensor
|
Xu, Jiangtao
|
|
|
111 |
C |
p.
|
artikel
|
| 3 |
Built-in self-repair structure for real-time fault recovery applications
|
Zandevakili, Hamed
|
|
|
111 |
C |
p.
|
artikel
|
| 4 |
Characterisation & modelling of perovskite-based synaptic memristor device
|
Gupta, Vishal
|
|
|
111 |
C |
p.
|
artikel
|
| 5 |
Clocked and event-driven redundant adjustable precision computing
|
Skaf, Ali
|
|
|
111 |
C |
p.
|
artikel
|
| 6 |
Design guideline on board-level thermomechanical reliability of 2.5D package
|
Shao, Shuai
|
|
|
111 |
C |
p.
|
artikel
|
| 7 |
Editorial Board
|
|
|
|
111 |
C |
p.
|
artikel
|
| 8 |
Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps
|
Zhu, Wenhui
|
|
|
111 |
C |
p.
|
artikel
|
| 9 |
Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination
|
Kwatra, Abhishek
|
|
|
111 |
C |
p.
|
artikel
|
| 10 |
Experimental and modeling studies of automotive-qualified OLEDs under electrical stress
|
Güney, Arda
|
|
|
111 |
C |
p.
|
artikel
|
| 11 |
FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
|
Grams, Arian
|
|
|
111 |
C |
p.
|
artikel
|
| 12 |
Influence of air atmosphere on electrical characteristics of p-type MoTe2 FETs under DC and pulsed mode operation
|
Seo, Seung Gi
|
|
|
111 |
C |
p.
|
artikel
|
| 13 |
“Limiting power cycling stress in power MOSFETs by active thermal control”
|
Magnone, Paolo
|
|
|
111 |
C |
p.
|
artikel
|
| 14 |
Mission profiles and hygrothermal conditions: Its effects on the reliability of a soft switching converter
|
De León Aldaco, Susana E.
|
|
|
111 |
C |
p.
|
artikel
|
| 15 |
Modelling stress evolution and voiding in advanced copper nano-interconnects under thermal gradients
|
Zahedmanesh, Houman
|
|
|
111 |
C |
p.
|
artikel
|
| 16 |
Protecting scratchpad memory addresses against soft errors
|
Mansoor, Ali
|
|
|
111 |
C |
p.
|
artikel
|
| 17 |
Reliability of RF MEMS switches at cryogenic (liquid He) temperatures
|
Benoit, R.R.
|
|
|
111 |
C |
p.
|
artikel
|
| 18 |
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process
|
Dai, Jingru
|
|
|
111 |
C |
p.
|
artikel
|
| 19 |
Single event transient hardened delay cell for a differential ring VCO
|
Karthigeyan, K.A.
|
|
|
111 |
C |
p.
|
artikel
|
| 20 |
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics
|
Zhang, Hongqiang
|
|
|
111 |
C |
p.
|
artikel
|
| 21 |
Study on interfacial trap location induced subthreshold slope degradation extracted by random telegraph noise for high-k/metal gate FinFET devices
|
Yang, Yi-Lin
|
|
|
111 |
C |
p.
|
artikel
|
| 22 |
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders
|
Lin, Qiaoli
|
|
|
111 |
C |
p.
|
artikel
|
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