| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
AM3D: An accurate crosstalk probability modeling to predict channel delay in 3D ICs
|
Shirmohammadi, Zahra
|
|
2019
|
102 |
C |
p.
|
article
|
| 2 |
A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles
|
Matallana, A.
|
|
2019
|
102 |
C |
p.
|
article
|
| 3 |
Analysis of Schottky emission electric charge transport mechanism in Cu-Lu2O3-Cu MIM structure by temperature dependent current-voltage characteristics
|
Akbar, Shahnaz
|
|
2019
|
102 |
C |
p.
|
article
|
| 4 |
A single event upset hardened flip-flop design utilizing layout technique
|
Wang, Haibin
|
|
2019
|
102 |
C |
p.
|
article
|
| 5 |
Degradation in electrothermal characteristics of 4H-SiC junction barrier Schottky diodes under high temperature power cycling stress
|
Tang, Yidan
|
|
2019
|
102 |
C |
p.
|
article
|
| 6 |
Editorial Board
|
|
|
2019
|
102 |
C |
p.
|
article
|
| 7 |
Editorial: IPFA 2018
|
Chin, Jiann Min
|
|
2019
|
102 |
C |
p.
|
article
|
| 8 |
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
|
Panchenko, Iuliana
|
|
2019
|
102 |
C |
p.
|
article
|
| 9 |
Heavy-ion induced radiation effects in 50 nm NAND floating gate flash memories
|
Yin, Ya-nan
|
|
2019
|
102 |
C |
p.
|
article
|
| 10 |
Heavy ion irradiation effects on GaN/AlGaN high electron mobility transistor failure at off-state
|
Islam, Zahabul
|
|
2019
|
102 |
C |
p.
|
article
|
| 11 |
In-circuit fault tolerance for FPGAs using dynamic reconfiguration and virtual overlays
|
Kourfali, Alexandra
|
|
2019
|
102 |
C |
p.
|
article
|
| 12 |
Investigating the latent reliability degradation of partially depleted SOI devices induced by high-energy heavy ions irradiation
|
Ma, Teng
|
|
2019
|
102 |
C |
p.
|
article
|
| 13 |
NBTI stress delay sensitivity analysis of reliability enhanced Schmitt trigger based circuits
|
Shah, Ambika Prasad
|
|
2019
|
102 |
C |
p.
|
article
|
| 14 |
Optical design and study of a wireless IV drip detection device
|
Tseng, Wei-Hsiung
|
|
2019
|
102 |
C |
p.
|
article
|
| 15 |
Prediction of IGBT power module remaining lifetime using the aging state approach
|
Li, Ling-Ling
|
|
2019
|
102 |
C |
p.
|
article
|
| 16 |
Probabilistic estimation of the application-level impact of precision scaling in approximate computing applications
|
Traiola, Marcello
|
|
2019
|
102 |
C |
p.
|
article
|
| 17 |
Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method
|
Gharaibeh, Mohammad A.
|
|
2019
|
102 |
C |
p.
|
article
|
| 18 |
Recent progress in electronic interconnection
|
Nishikawa, Hiroshi
|
|
2019
|
102 |
C |
p.
|
article
|
| 19 |
Reducing false positives due to double adjacent errors in instruction TLBs
|
Sánchez-Macián, A.
|
|
2019
|
102 |
C |
p.
|
article
|
| 20 |
Reliability analysis of tape based chip-scale packages based metamodel
|
Hamdani, Hamid
|
|
2019
|
102 |
C |
p.
|
article
|
| 21 |
Residual stress measurement through the thickness of ball grid array microelectronics packages using incremental hole drilling
|
Hosseini, S.M.
|
|
2019
|
102 |
C |
p.
|
article
|
| 22 |
Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints
|
Pin, S.
|
|
2019
|
102 |
C |
p.
|
article
|
| 23 |
Trap induced negative differential conductance and back-gated charge redistribution in AlGaN/GaN power devices
|
Binder, Andrew T.
|
|
2019
|
102 |
C |
p.
|
article
|
| 24 |
Variability of metal/h-BN/metal memristors grown via chemical vapor deposition on different materials
|
Villena, Marco A.
|
|
2019
|
102 |
C |
p.
|
article
|
| 25 |
Vibration lifetime estimation of PBGA solder joints using Steinberg model
|
An, Tong
|
|
2019
|
102 |
C |
p.
|
article
|
Journal description