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Tijdschrift beschrijving
Alle jaargangen van het bijbehorende tijdschrift
Alle afleveringen van het bijbehorende jaargang
Alle artikelen van de bijbehorende aflevering
39 gevonden resultaten
| nr | titel | auteur | tijdschrift | jaar | jaarg. | afl. | pagina('s) | type |
| 1 | Anisotropic Conductive Adhesives for Flip-Chip Interconnects |
Wang, Weiqiang |
2008 |
22 | 8 |
p. 871-892 |
artikel |
|
| 2 | Anisotropic Conductive Adhesives for Flip-Chip Interconnects |
Wang, WeiqiangCenter for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA |
2008 |
22 | 8 |
p. 871-892 |
artikel |
|
| 3 | An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement |
Lewis, H. J. |
2008 |
22 | 8 |
p. 801-813 |
artikel |
|
| 4 | An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement |
Lewis, H. J.College of Engineering, University of Limerick, Limerick, Ireland;, Email: huw.lewis@ul.ie |
2008 |
22 | 8 |
p. 801-813 |
artikel |
|
| 5 | An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement |
Lewis, H. J.College of Engineering, University of Limerick, Limerick, Ireland;, Email: huw.lewis@ul.ie |
2008 |
22 | 8 |
p. 801-813 |
artikel |
|
| 6 | Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure |
Zhou, Jianguo |
2008 |
22 | 8 |
p. 957-981 |
artikel |
|
| 7 | Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure |
Zhou, JianguoDepartment of Polymer Engineering, The University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 957-981 |
artikel |
|
| 8 | Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure |
Zhou, JianguoDepartment of Polymer Engineering, The University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 957-981 |
artikel |
|
| 9 | Editorial Note |
Mittal, Kash |
2008 |
22 | 8 |
p. 795-795 |
artikel |
|
| 10 | Editorial Note |
Mittal, Kash |
2008 |
22 | 8 |
p. 795-795 |
artikel |
|
| 11 | Editorial Note |
Mittal, Kash |
2008 |
22 | 8 |
p. 795-795 |
artikel |
|
| 12 | Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications |
Matienzo, L. J. |
2008 |
22 | 8 |
p. 853-869 |
artikel |
|
| 13 | Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications |
Matienzo, L. J.Endicott Interconnect Technologies, Inc. Endicott, NY 13760, USA;, Email: matienzo@eitny.com |
2008 |
22 | 8 |
p. 853-869 |
artikel |
|
| 14 | Fatigue Behavior of Electrically Conductive Adhesives |
Su, Bin |
2008 |
22 | 8 |
p. 927-946 |
artikel |
|
| 15 | Fatigue Behavior of Electrically Conductive Adhesives |
Su, BinThe George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405, USA |
2008 |
22 | 8 |
p. 927-946 |
artikel |
|
| 16 | Fatigue Behavior of Electrically Conductive Adhesives |
Su, BinThe George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405, USA |
2008 |
22 | 8 |
p. 927-946 |
artikel |
|
| 17 | Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives |
Zhou, Jianguo |
2008 |
22 | 8 |
p. 947-956 |
artikel |
|
| 18 | Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives |
Zhou, JianguoDepartment of Polymer Engineering, University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 947-956 |
artikel |
|
| 19 | Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives |
Zhou, JianguoDepartment of Polymer Engineering, University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 947-956 |
artikel |
|
| 20 | Guest Editorial |
Gomatam, Rajesh |
2008 |
22 | 8 |
p. 797-799 |
artikel |
|
| 21 | Guest Editorial |
Gomatam, RajeshLehigh University, 19 Memorial Drive West, Packard Lab, Department of Mechanical Engineering and Mechanics, Bethlehem, PA 18015, USA;, Email: rajesh.gomatam@gmail.com |
2008 |
22 | 8 |
p. 797-799 |
artikel |
|
| 22 | Guest Editorial |
Gomatam, RajeshLehigh University, 19 Memorial Drive West, Packard Lab, Department of Mechanical Engineering and Mechanics, Bethlehem, PA 18015, USA;, Email: rajesh.gomatam@gmail.com |
2008 |
22 | 8 |
p. 797-799 |
artikel |
|
| 23 | Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives |
Teo, Mary |
2008 |
22 | 8 |
p. 1003-1015 |
artikel |
|
| 24 | Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives |
Teo, MaryInfineon Technologies Asia Pacific Pte Ltd, Assembly & Interconnect Technology, 168 Kallang Way, Singapore 349253;, Email: mary.teo@infineon.com |
2008 |
22 | 8 |
p. 1003-1015 |
artikel |
|
| 25 | Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives |
Teo, MaryInfineon Technologies Asia Pacific Pte Ltd, Assembly & Interconnect Technology, 168 Kallang Way, Singapore 349253;, Email: mary.teo@infineon.com |
2008 |
22 | 8 |
p. 1003-1015 |
artikel |
|
| 26 | Operating Temperature of Anisotropic Conducting Film Adhesives |
Divigalpitiya, Ranjith |
2008 |
22 | 8 |
p. 915-926 |
artikel |
|
| 27 | Operating Temperature of Anisotropic Conducting Film Adhesives |
Divigalpitiya, Ranjith3M Canada Company, 1840 Oxford Street East, London, Ontario, Canada N5V 3R6;, Email: rdivigalpitiya@mmm.com |
2008 |
22 | 8 |
p. 915-926 |
artikel |
|
| 28 | Operating Temperature of Anisotropic Conducting Film Adhesives |
Divigalpitiya, Ranjith3M Canada Company, 1840 Oxford Street East, London, Ontario, Canada N5V 3R6;, Email: rdivigalpitiya@mmm.com |
2008 |
22 | 8 |
p. 915-926 |
artikel |
|
| 29 | Recent Advances in Developing High Performance Isotropic Conductive Adhesives |
Daniel Lu, Daoqiang |
2008 |
22 | 8 |
p. 835-851 |
artikel |
|
| 30 | Recent Advances in Developing High Performance Isotropic Conductive Adhesives |
Daniel Lu, DaoqiangIntel Corporation, 5000 W. Chandler Blvd, Chandler, AZ 85226, USA |
2008 |
22 | 8 |
p. 835-851 |
artikel |
|
| 31 | Recent Advances in Developing High Performance Isotropic Conductive Adhesives |
Daniel Lu, DaoqiangIntel Corporation, 5000 W. Chandler Blvd, Chandler, AZ 85226, USA |
2008 |
22 | 8 |
p. 835-851 |
artikel |
|
| 32 | Recent Advances in Nano-conductive Adhesives |
Daniel Lu, Daoqiang |
2008 |
22 | 8 |
p. 815-834 |
artikel |
|
| 33 | Recent Advances in Nano-conductive Adhesives |
Daniel Lu, DaoqiangIntel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226, USA;, Email: daniellu66@gmail.com |
2008 |
22 | 8 |
p. 815-834 |
artikel |
|
| 34 | Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions |
Zhou, Jianguo |
2008 |
22 | 8 |
p. 983-1002 |
artikel |
|
| 35 | Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions |
Zhou, JianguoDepartment of Polymer Engineering, The University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 983-1002 |
artikel |
|
| 36 | Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions |
Zhou, JianguoDepartment of Polymer Engineering, The University of Akron, Akron, OH 44325-0301, USA |
2008 |
22 | 8 |
p. 983-1002 |
artikel |
|
| 37 | Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives |
Lewis, H. J. |
2008 |
22 | 8 |
p. 893-913 |
artikel |
|
| 38 | Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives |
Lewis, H. J.College of Engineering, University of Limerick, Limerick, Ireland;, Email: huw.lewis@ul.ie |
2008 |
22 | 8 |
p. 893-913 |
artikel |
|
| 39 | Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives |
Lewis, H. J.College of Engineering, University of Limerick, Limerick, Ireland;, Email: huw.lewis@ul.ie |
2008 |
22 | 8 |
p. 893-913 |
artikel |
39 gevonden resultaten