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Journal description
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Details for article 1 of 39 found articles
| Title: |
Anisotropic Conductive Adhesives for Flip-Chip Interconnects |
| Author: |
Wang, Weiqiang Chan, Y. C. Pecht, Michael |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 22 (2008) nr. 8 pages 871-892 |
| Year: |
2008-06-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 39 found articles
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