| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
|
Li, Jing
|
|
2008
|
22 |
14 |
p. 1659-1671
|
artikel
|
| 2 |
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
|
Li, Jing
|
|
2008
|
22 |
14 |
p. 1659-1671
|
artikel
|
| 3 |
Drop Test Performance of Isotropic Electrically Conductive Adhesives
|
Morris, James
|
|
2008
|
22 |
14 |
p. 1699-1716
|
artikel
|
| 4 |
Drop Test Performance of Isotropic Electrically Conductive Adhesives
|
Morris, James
|
|
2008
|
22 |
14 |
p. 1699-1716
|
artikel
|
| 5 |
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
|
Lin, Yung-Sen
|
|
2008
|
22 |
14 |
p. 1673-1697
|
artikel
|
| 6 |
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
|
Lin, Yung-Sen
|
|
2008
|
22 |
14 |
p. 1673-1697
|
artikel
|
| 7 |
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
|
Zhang, Yan
|
|
2008
|
22 |
14 |
p. 1717-1731
|
artikel
|
| 8 |
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
|
Zhang, Yan
|
|
2008
|
22 |
14 |
p. 1717-1731
|
artikel
|
| 9 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
|
Haase, J.
|
|
2008
|
22 |
14 |
p. 1733-1756
|
artikel
|
| 10 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
|
Haase, J.
|
|
2008
|
22 |
14 |
p. 1733-1756
|
artikel
|
| 11 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
|
Farley, D.
|
|
2008
|
22 |
14 |
p. 1757-1780
|
artikel
|
| 12 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
|
Farley, D.
|
|
2008
|
22 |
14 |
p. 1757-1780
|
artikel
|
| 13 |
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
|
Lin, Y. C.
|
|
2008
|
22 |
14 |
p. 1631-1657
|
artikel
|
| 14 |
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
|
Lin, Y. C.
|
|
2008
|
22 |
14 |
p. 1631-1657
|
artikel
|
| 15 |
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
|
Yim, Myung Jin
|
|
2008
|
22 |
14 |
p. 1593-1630
|
artikel
|
| 16 |
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
|
Yim, Myung Jin
|
|
2008
|
22 |
14 |
p. 1593-1630
|
artikel
|
| 17 |
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
|
Zenner, Robert
|
|
2008
|
22 |
14 |
p. 1781-1797
|
artikel
|
| 18 |
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
|
Zenner, Robert
|
|
2008
|
22 |
14 |
p. 1781-1797
|
artikel
|
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