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Journal description
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Details for article 5 of 18 found articles
| Title: |
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles |
| Author: |
Lin, Yung-Sen Chiu, Sheng-Shiang |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 22 (2008) nr. 14 pages 1673-1697 |
| Year: |
2008-09-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 18 found articles
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