nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A New Finite Element Formulation for Thin Non-Homogeneous Heat-Conducting Adhesive Layers
|
Öchsner, Andreas |
|
2008 |
22 |
13 |
p. 1365-1378 |
artikel |
2 |
A New Finite Element Formulation for Thin Non-Homogeneous Heat-Conducting Adhesive Layers
|
Öchsner, Andreas |
|
2008 |
22 |
13 |
p. 1365-1378 |
artikel |
3 |
Computational Modelling of the Residual Strength of Repaired Composite Laminates Using a Cohesive Damage Model
|
Campilho, R. D. S. G. |
|
2008 |
22 |
13 |
p. 1565-1591 |
artikel |
4 |
Computational Modelling of the Residual Strength of Repaired Composite Laminates Using a Cohesive Damage Model
|
Campilho, R. D. S. G. |
|
2008 |
22 |
13 |
p. 1565-1591 |
artikel |
5 |
Curing Behavior and Adhesion Performance of UV-Curable Styrene–Isoprene–Styrene-Based Pressure-Sensitive Adhesives
|
Park, Young-Jun |
|
2008 |
22 |
13 |
p. 1401-1423 |
artikel |
6 |
Editorial Note
|
Mittal, Kash |
|
2008 |
22 |
13 |
p. 1333-1333 |
artikel |
7 |
Editorial Note
|
Mittal, Kash |
|
2008 |
22 |
13 |
p. 1333-1333 |
artikel |
8 |
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste
|
Noh, Bo-In |
|
2008 |
22 |
13 |
p. 1355-1364 |
artikel |
9 |
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste
|
Noh, Bo-In |
|
2008 |
22 |
13 |
p. 1355-1364 |
artikel |
10 |
Guest Editorial
|
da Silva, Lucas |
|
2008 |
22 |
13 |
p. 1335-1337 |
artikel |
11 |
Guest Editorial
|
da Silva, Lucas |
|
2008 |
22 |
13 |
p. 1335-1337 |
artikel |
12 |
Identification of the Strain Rate Parameters for Structural Adhesives
|
Fancello, E. |
|
2008 |
22 |
13 |
p. 1523-1540 |
artikel |
13 |
Identification of the Strain Rate Parameters for Structural Adhesives
|
Fancello, E. |
|
2008 |
22 |
13 |
p. 1523-1540 |
artikel |
14 |
Influence of Silanisation Parameters With γ-Methacryloxypropyltrimethoxysilane on Durability of Aluminium/Acrylic Adhesive Joints
|
Del Real, J. C. |
|
2008 |
22 |
13 |
p. 1461-1475 |
artikel |
15 |
Influence of Silanisation Parameters With γ-Methacryloxypropyltrimethoxysilane on Durability of Aluminium/Acrylic Adhesive Joints
|
Del Real, J. C. |
|
2008 |
22 |
13 |
p. 1461-1475 |
artikel |
16 |
Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application
|
Lee, Hee-Jung |
|
2008 |
22 |
13 |
p. 1379-1386 |
artikel |
17 |
Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application
|
Lee, Hee-Jung |
|
2008 |
22 |
13 |
p. 1379-1386 |
artikel |
18 |
Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films
|
Kim, Jong-Woong |
|
2008 |
22 |
13 |
p. 1339-1354 |
artikel |
19 |
Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films
|
Kim, Jong-Woong |
|
2008 |
22 |
13 |
p. 1339-1354 |
artikel |
20 |
Molecular Dynamics Simulation of Polymer–Metal Bonds
|
Suérez, J. C. |
|
2008 |
22 |
13 |
p. 1387-1400 |
artikel |
21 |
Molecular Dynamics Simulation of Polymer–Metal Bonds
|
Suérez, J. C. |
|
2008 |
22 |
13 |
p. 1387-1400 |
artikel |
22 |
On Modelling the Non-linear Behaviour of Thin Adhesive Films in Bonded Assemblies With Interface Elements
|
Créac'hcadec, R. |
|
2008 |
22 |
13 |
p. 1541-1563 |
artikel |
23 |
On Modelling the Non-linear Behaviour of Thin Adhesive Films in Bonded Assemblies With Interface Elements
|
Créac'hcadec, R. |
|
2008 |
22 |
13 |
p. 1541-1563 |
artikel |
24 |
Parametric Study of Adhesively Bonded Single Lap Joints by the Taguchi Method
|
da Silva, Lucas |
|
2008 |
22 |
13 |
p. 1477-1494 |
artikel |
25 |
Parametric Study of Adhesively Bonded Single Lap Joints by the Taguchi Method
|
da Silva, Lucas |
|
2008 |
22 |
13 |
p. 1477-1494 |
artikel |
26 |
Peel Behaviour of Aircraft Fuel Tank Sealants: the Effect of Peel Angle, Sealant Layer Thickness and Peel Rate
|
Giannis, S. |
|
2008 |
22 |
13 |
p. 1495-1522 |
artikel |
27 |
Peel Behaviour of Aircraft Fuel Tank Sealants: the Effect of Peel Angle, Sealant Layer Thickness and Peel Rate
|
Giannis, S. |
|
2008 |
22 |
13 |
p. 1495-1522 |
artikel |
28 |
Surface Modification of Low Density Polyethylene (LDPE) Film Using Corona Discharge Plasma for Technological Applications
|
Pascual, M. |
|
2008 |
22 |
13 |
p. 1425-1442 |
artikel |
29 |
Surface Modification of Low Density Polyethylene (LDPE) Film Using Corona Discharge Plasma for Technological Applications
|
Pascual, M. |
|
2008 |
22 |
13 |
p. 1425-1442 |
artikel |
30 |
The Effect of Surface Modification of Silica Microfillers in an Epoxy Matrix on the Thermo-mechanical Properties
|
Olmos, D. |
|
2008 |
22 |
13 |
p. 1443-1459 |
artikel |
31 |
The Effect of Surface Modification of Silica Microfillers in an Epoxy Matrix on the Thermo-mechanical Properties
|
Olmos, D. |
|
2008 |
22 |
13 |
p. 1443-1459 |
artikel |