| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A complete analytical model for circular diaphragm pressure sensor with freely supported edge
|
Jindal, Sumit Kumar
|
|
2014
|
21 |
5 |
p. 1073-1079
|
artikel
|
| 2 |
Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
|
Rebhan, B.
|
|
2015
|
21 |
5 |
p. 1003-1013
|
artikel
|
| 3 |
Conductivity of high-temperature annealed silicon direct wafer bonds
|
Schjølberg-Henriksen, Kari
|
|
2015
|
21 |
5 |
p. 979-985
|
artikel
|
| 4 |
Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
|
Bansal, Deepak
|
|
2014
|
21 |
5 |
p. 1047-1052
|
artikel
|
| 5 |
Development of a novel microviscosity model based on molecular chain length
|
Lou, Yan
|
|
2014
|
21 |
5 |
p. 1121-1130
|
artikel
|
| 6 |
Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films
|
Beche, E.
|
|
2015
|
21 |
5 |
p. 953-959
|
artikel
|
| 7 |
Fabrication and characterization of a dry electrode integrated Gecko-inspired dry adhesive medical patch for long-term ECG measurement
|
Wang, Long-Fei
|
|
2014
|
21 |
5 |
p. 1093-1100
|
artikel
|
| 8 |
Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick film
|
Wang, Shushan
|
|
2014
|
21 |
5 |
p. 1053-1059
|
artikel
|
| 9 |
Fabrication of miniature parts using nano-sized powders and an environmentally friendly binder through micro powder injection molding
|
Rajabi, Javad
|
|
2014
|
21 |
5 |
p. 1131-1136
|
artikel
|
| 10 |
Governance, policy, and legislation of nanotechnology: a perspective
|
Bhushan, Bharat
|
|
2015
|
21 |
5 |
p. 1137-1155
|
artikel
|
| 11 |
Kinetics of low temperature direct copper–copper bonding
|
Gondcharton, P.
|
|
2015
|
21 |
5 |
p. 995-1001
|
artikel
|
| 12 |
Laser welding of sapphire wafers using a thin-film fresnoite glass solder
|
de Pablos-Martín, Araceli
|
|
2014
|
21 |
5 |
p. 1035-1045
|
artikel
|
| 13 |
Local thermal-assisted ultrasonic embossing for the fabrication of polymer microstructures
|
Qi, Na
|
|
2014
|
21 |
5 |
p. 1101-1110
|
artikel
|
| 14 |
Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure
|
Imbert, B.
|
|
2015
|
21 |
5 |
p. 973-977
|
artikel
|
| 15 |
Mechanism involved in direct hydrophobic Si(100)-2×1:H bonding
|
Rauer, C.
|
|
2015
|
21 |
5 |
p. 961-968
|
artikel
|
| 16 |
Modelling of the direct bonding wave
|
Radisson, Damien
|
|
2015
|
21 |
5 |
p. 969-971
|
artikel
|
| 17 |
Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology
|
Montméat, P.
|
|
2015
|
21 |
5 |
p. 987-993
|
artikel
|
| 18 |
Silicon–ceramic–silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
|
Günschmann, S.
|
|
2015
|
21 |
5 |
p. 1029-1034
|
artikel
|
| 19 |
Small modified printed planar ultrawide band disc antennas with etched ground plane
|
Sasibhushana Rao, G.
|
|
2014
|
21 |
5 |
p. 1081-1086
|
artikel
|
| 20 |
Special issue WaferBond’13
|
Knechtel, Roy
|
|
2015
|
21 |
5 |
p. 951
|
artikel
|
| 21 |
The on-chip temperature compensation and temperature control research for the silicon micro-gyroscope
|
Yang, Bo
|
|
2014
|
21 |
5 |
p. 1061-1072
|
artikel
|
| 22 |
The plastic and creep characteristics of silicon microstructure at elevated temperature
|
Yao, Shaokang
|
|
2014
|
21 |
5 |
p. 1111-1119
|
artikel
|
| 23 |
UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding
|
Anantha, P.
|
|
2015
|
21 |
5 |
p. 1015-1020
|
artikel
|
| 24 |
Wafer level vacuum packaging of micro-mirrors with buried signal lines
|
Langa, S.
|
|
2015
|
21 |
5 |
p. 1021-1028
|
artikel
|
| 25 |
Wide-band millimetre-wave antenna based on Si and suspended BCB membrane
|
Seok, Seonho
|
|
2014
|
21 |
5 |
p. 1087-1092
|
artikel
|
Tijdschrift beschrijving