| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Anodic bonding of glass to aluminium
|
Schjølberg-Henriksen, K.
|
|
2005
|
12 |
5 |
p. 441-449
|
artikel
|
| 2 |
Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
|
Frömel, J.
|
|
2005
|
12 |
5 |
p. 481-483
|
artikel
|
| 3 |
A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
|
Knechtel, R.
|
|
2005
|
12 |
5 |
p. 462-467
|
artikel
|
| 4 |
Bonded thick film SOI with pre-etched cavities
|
Suni, Tommi
|
|
2006
|
12 |
5 |
p. 406-412
|
artikel
|
| 5 |
Direct bonding with on-wafer metal interconnections
|
Jia, C.
|
|
2005
|
12 |
5 |
p. 391-396
|
artikel
|
| 6 |
Discussion of tooling solutions for the direct bonding of silicon wafers
|
Aitken, Nick
|
|
2005
|
12 |
5 |
p. 413-417
|
artikel
|
| 7 |
Effect of interfacial SiO2 thickness for low temperature O2 plasma activated wafer bonding
|
Olbrechts, Benoit
|
|
2005
|
12 |
5 |
p. 383-390
|
artikel
|
| 8 |
Fabrication and mechanical testing of glass chips for high-pressure synthetic or analytical chemistry
|
Oosterbroek, R. E.
|
|
2005
|
12 |
5 |
p. 450-454
|
artikel
|
| 9 |
Fabrication of microfluidic networks with integrated electrodes
|
Hermes, D. C.
|
|
2005
|
12 |
5 |
p. 436-440
|
artikel
|
| 10 |
Influence of the frequency on fatigue of directly wafer-bonded silicon
|
Bagdahn, Jörg
|
|
2005
|
12 |
5 |
p. 430-435
|
artikel
|
| 11 |
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)
|
Luoto, H.
|
|
2005
|
12 |
5 |
p. 401-405
|
artikel
|
| 12 |
Mechanical properties of glass frit bonded micro packages
|
Dresbach, C.
|
|
2005
|
12 |
5 |
p. 473-480
|
artikel
|
| 13 |
Surface plasma treatments enabling low temperature direct bonding
|
Moriceau, Hubert
|
|
2005
|
12 |
5 |
p. 378-382
|
artikel
|
| 14 |
Transfer of small structures by bonding
|
Villanueva, G.
|
|
2005
|
12 |
5 |
p. 455-461
|
artikel
|
| 15 |
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
|
Doll, Alexander
|
|
2005
|
12 |
5 |
p. 418-429
|
artikel
|
| 16 |
Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle
|
Michel, Bernd
|
|
2006
|
12 |
5 |
p. 377
|
artikel
|
| 17 |
Wafer direct bonding with ambient pressure plasma activation
|
Gabriel, Markus
|
|
2006
|
12 |
5 |
p. 397-400
|
artikel
|
| 18 |
Wafer level encapsulation of microsystems using glass frit bonding
|
Knechtel, R.
|
|
2005
|
12 |
5 |
p. 468-472
|
artikel
|
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