nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A capacitance and optical method for the static and dynamic characterization of micro electro mechanical systems (MEMS) devices
|
Ferraris, Eleonora |
|
2006 |
12 |
10-11 |
p. 1053-1061 |
artikel |
2 |
A dielectrophoretic chip packaged at wafer level
|
Iliescu, Ciprian |
|
2006 |
12 |
10-11 |
p. 987-992 |
artikel |
3 |
Comparison of analysis methods for package-induced stresses on moulded Hall sensors
|
Fischer, Sebastian |
|
2006 |
12 |
10-11 |
p. 1005-1009 |
artikel |
4 |
Defect-free wet etching through pyrex glass using Cr/Au mask
|
Tay, Francis E. H. |
|
2006 |
12 |
10-11 |
p. 935-939 |
artikel |
5 |
Design, test, integration and packaging of MEMS/MOEMS, 2005
|
Courtois, Bernard |
|
2006 |
12 |
10-11 |
p. 891 |
artikel |
6 |
Development of a simple microsystems membrane probe card
|
Cooke, M.D. |
|
2006 |
12 |
10-11 |
p. 1037-1044 |
artikel |
7 |
Elastic–plastic modeling of heat-treated bimorph micro-cantilevers
|
Lee, Chia-Yen |
|
2006 |
12 |
10-11 |
p. 979-986 |
artikel |
8 |
Fabrication of planar and three-dimensional microcoils on flexible substrates
|
Woytasik, M. |
|
2006 |
12 |
10-11 |
p. 973-978 |
artikel |
9 |
Fabrication of silicon-based two-dimensional photonic crystals
|
Zhu, Jian |
|
2006 |
12 |
10-11 |
p. 919-922 |
artikel |
10 |
Fabrication process of a micro-inductor utilising a magnetic thin film core
|
Flynn, D. |
|
2006 |
12 |
10-11 |
p. 923-933 |
artikel |
11 |
Gold metallizations for eutectic bonding of silicon wafers
|
Lani, S. |
|
2006 |
12 |
10-11 |
p. 1021-1025 |
artikel |
12 |
HF-contact elements for testing and multi chip module applications
|
Spanier, G. |
|
2006 |
12 |
10-11 |
p. 1015-1019 |
artikel |
13 |
Horizontal buried channels in monocrystalline silicon
|
Sagazan, O. De |
|
2006 |
12 |
10-11 |
p. 959-963 |
artikel |
14 |
MEMS-based combustor with hairpin-shape design of gas recirculation channel
|
Wang, Z. F. |
|
2006 |
12 |
10-11 |
p. 993-997 |
artikel |
15 |
MEMS-based formaldehyde gas sensor integrated with a micro-hotplate
|
Lee, Chia-Yen |
|
2006 |
12 |
10-11 |
p. 893-898 |
artikel |
16 |
Mems inertial power generators for biomedical applications
|
Miao, P. |
|
2006 |
12 |
10-11 |
p. 1079-1083 |
artikel |
17 |
Micro-electro-mechanical systems fast fabrication by selective thick polysilicon growth in epitaxial reactor
|
Sagazan, O. De |
|
2006 |
12 |
10-11 |
p. 953-958 |
artikel |
18 |
Microelectromechanical systems vibration powered electromagnetic generator for wireless sensor applications
|
Koukharenko, E. |
|
2006 |
12 |
10-11 |
p. 1071-1077 |
artikel |
19 |
Micromachined silicon via-holes and interdigital bandpass filters
|
Zhu, Jian |
|
2006 |
12 |
10-11 |
p. 913-917 |
artikel |
20 |
Micro powder injection molding: process characterization and modeling
|
Heldele, Richard |
|
2006 |
12 |
10-11 |
p. 941-946 |
artikel |
21 |
Micro ultrasonic welding: joining of chemically inert polymer microparts for single material fluidic components and systems
|
TruckenmĂĽller, R. |
|
2006 |
12 |
10-11 |
p. 1027-1029 |
artikel |
22 |
Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication
|
Worgull, M. |
|
2006 |
12 |
10-11 |
p. 947-952 |
artikel |
23 |
New production method of convex microlens arrays for integrated fluorescence microfluidic detection systems
|
Yang, H. |
|
2006 |
12 |
10-11 |
p. 907-912 |
artikel |
24 |
Replication and bonding techniques for integrated microfluidic systems
|
Heckele, M. |
|
2006 |
12 |
10-11 |
p. 1031-1035 |
artikel |
25 |
Solder bonding with a buffer layer for MOEMS packaging using induction heating
|
Hu, Chao-Chang |
|
2006 |
12 |
10-11 |
p. 1011-1014 |
artikel |
26 |
Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system
|
Lin, Ming-Tzer |
|
2006 |
12 |
10-11 |
p. 1045-1051 |
artikel |
27 |
The study of a novel crystal SiGeC far infrared sensor with thermal isolated by MEMS technology
|
Hsieh, M. C. |
|
2006 |
12 |
10-11 |
p. 999-1004 |
artikel |
28 |
Triplex-pumping CD-like microfluidic platform with parabolic microchannels
|
Wang, G. J. |
|
2006 |
12 |
10-11 |
p. 899-905 |
artikel |
29 |
Two-dimensional monomode optical fibre array manufacture using microengineering techniques
|
Weiland, D. |
|
2006 |
12 |
10-11 |
p. 965-972 |
artikel |
30 |
Vacuum measurement in wafer level encapsulations by interference microscopy
|
Bosseboeuf, A. |
|
2006 |
12 |
10-11 |
p. 1063-1069 |
artikel |