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                             29 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A 3D-CAM system for quick prototyping and microfabrication using excimer laser micromachining Mutapcic, Emir
2005
12 1-2 p. 128-136
artikel
2 A methodology to extract dynamic compact thermal models under time-varying boundary conditions: application to a thermopile based IR sensor Salleras, M.
2005
12 1-2 p. 21-29
artikel
3 A study of integration of LIGA and M-EDM technology on the microinjection molding of ink-jet printers’ nozzle plates Tseng, Shi-Chang
2005
12 1-2 p. 116-119
artikel
4 Behavioral VHDL-AMS model and experimental validation of a nuclear magnetic resonance sensor Megherbi, S.
2005
12 1-2 p. 38-43
artikel
5 Bio-MEMS fabricated artificial capillaries for tissue engineering Wang, G. J.
2005
12 1-2 p. 120-127
artikel
6 Design, Test, Integration and Packaging of MEMS/MOEMS, 2004 Michel, Bernd
2005
12 1-2 p. 1
artikel
7 Development of a low cost hybrid Si/PDMS multi-layered pneumatic microvalve Thuillier, Gaël
2005
12 1-2 p. 180-185
artikel
8 Electronic Mosquito: designing a semi-invasive Microsystem for blood sampling, analysis and drug delivery applications Gattiker, Giorgio E.
2005
12 1-2 p. 44-51
artikel
9 Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirror Parrain, Fabien
2005
12 1-2 p. 8-14
artikel
10 Fabrication and optimization of bimorph micro probes for the measurement of individual biocells Cho, Y. H.
2005
12 1-2 p. 30-37
artikel
11 Fabrication of an accurately vertical sidewall for optical switch applications using deep RIE and photoresist spray coating Ikehara, T.
2005
12 1-2 p. 98-103
artikel
12 Fabrication of microlens array with graduated sags using UV proximity printing method Yang, H.
2005
12 1-2 p. 82-90
artikel
13 Feature length-scale modeling of LPCVD and PECVD MEMS fabrication processes Musson, Lawrence C.
2005
12 1-2 p. 137-142
artikel
14 Glass frit bonding: an universal technology for wafer level encapsulation and packaging Knechtel, Roy
2005
12 1-2 p. 63-68
artikel
15 Integrated electromagnetic microactuators with a large driving force Pan, C.-T.
2005
12 1-2 p. 173-179
artikel
16 Large-scale hot embossing Worgull, M.
2005
12 1-2 p. 110-115
artikel
17 Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks Brida, S.
2005
12 1-2 p. 59-62
artikel
18 MOEMS: packaging and testing Wang, Z. F.
2005
12 1-2 p. 52-58
artikel
19 Preparation of ferroelectric ceramics in a film structure and their photovoltaic properties Ichiki, M.
2005
12 1-2 p. 143-148
artikel
20 Reliability study of AlTi/TiW on polysilicon contacts for high temperature sensors Andrei, A.
2005
12 1-2 p. 149-153
artikel
21 Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser Chung, C. K.
2005
12 1-2 p. 104-109
artikel
22 SOI-CMOS compatible low-power gas sensor using sputtered and drop-coated metal-oxide active layers Ivanov, P.
2005
12 1-2 p. 160-168
artikel
23 Stable SOI micromachined electrostatic AC voltage reference Kärkkäinen, Anu
2005
12 1-2 p. 169-172
artikel
24 Super-fine ink-jet printing: toward the minimal manufacturing system Murata, Kazuhiro
2005
12 1-2 p. 2-7
artikel
25 The influence of package-induced stresses on moulded Hall sensors Fischer, Sebastian
2005
12 1-2 p. 69-74
artikel
26 Thermo-mechanical analysis of advanced electronic packages in early system design Sommer, Johann-Peter
2005
12 1-2 p. 75-81
artikel
27 Transient thermal characterisation of hot plates Bognár, Gy.
2005
12 1-2 p. 154-159
artikel
28 Tunable Fabry-Perot surface micromachined interferometer-experiments and modeling Müller, Raluca
2005
12 1-2 p. 91-97
artikel
29 V-shaped micromechanical tunable capacitors for RF applications Cruau, Aurélie
2005
12 1-2 p. 15-20
artikel
                             29 gevonden resultaten
 
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