| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments
|
Subramanian, K. N.
|
|
2006
|
18 |
1-3 |
p. 237-246
|
artikel
|
| 2 |
Composite lead-free electronic solders
|
Guo, Fu
|
|
2006
|
18 |
1-3 |
p. 129-145
|
artikel
|
| 3 |
Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders
|
Vianco, Paul T.
|
|
2006
|
18 |
1-3 |
p. 93-119
|
artikel
|
| 4 |
Deformation behavior of tin and some tin alloys
|
Yang, Fuqian
|
|
2006
|
18 |
1-3 |
p. 191-210
|
artikel
|
| 5 |
Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
|
Anderson, Iver E.
|
|
2006
|
18 |
1-3 |
p. 55-76
|
artikel
|
| 6 |
Electromigration issues in lead-free solder joints
|
Chen, Chih
|
|
2006
|
18 |
1-3 |
p. 259-268
|
artikel
|
| 7 |
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
|
Chae, Seung-Hyun
|
|
2006
|
18 |
1-3 |
p. 247-258
|
artikel
|
| 8 |
Impact of the ROHS Directive on high-performance electronic systems
|
Puttlitz, Karl J.
|
|
2006
|
18 |
1-3 |
p. 347-365
|
artikel
|
| 9 |
Impact of the ROHS directive on high-performance electronic systems
|
Puttlitz, Karl J.
|
|
2006
|
18 |
1-3 |
p. 331-346
|
artikel
|
| 10 |
Interfacial reaction issues for lead-free electronic solders
|
Ho, C. E.
|
|
2006
|
18 |
1-3 |
p. 155-174
|
artikel
|
| 11 |
Issues related to the implementation of Pb-free electronic solders in consumer electronics
|
Frear, D. R.
|
|
2006
|
18 |
1-3 |
p. 319-330
|
artikel
|
| 12 |
Life expectancies of Pb-free SAC solder interconnects in electronic hardware
|
Osterman, Michael
|
|
2006
|
18 |
1-3 |
p. 229-236
|
artikel
|
| 13 |
Mechanical fatigue of Sn-rich Pb-free solder alloys
|
Shang, J. K.
|
|
2006
|
18 |
1-3 |
p. 211-227
|
artikel
|
| 14 |
Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
|
Chawla, N.
|
|
2006
|
18 |
1-3 |
p. 175-189
|
artikel
|
| 15 |
Phase Diagrams of Pb-Free Solders and their Related Materials Systems
|
Chen, Sinn-Wen
|
|
2006
|
18 |
1-3 |
p. 19-37
|
artikel
|
| 16 |
Preface
|
Subramanian, K. N.
|
|
2006
|
18 |
1-3 |
p. 1-2
|
artikel
|
| 17 |
Processing and material issues related to lead-free soldering
|
Turbini, Laura J.
|
|
2006
|
18 |
1-3 |
p. 147-154
|
artikel
|
| 18 |
Rare-earth additions to lead-free electronic solders
|
Wu, C. M. L.
|
|
2006
|
18 |
1-3 |
p. 77-91
|
artikel
|
| 19 |
Sn-whiskers: truths and myths
|
Osenbach, J. W.
|
|
2006
|
18 |
1-3 |
p. 283-305
|
artikel
|
| 20 |
Sn–Zn low temperature solder
|
Suganuma, Katsuaki
|
|
2006
|
18 |
1-3 |
p. 121-127
|
artikel
|
| 21 |
Stress analysis of spontaneous Sn whisker growth
|
Tu, K. N.
|
|
2006
|
18 |
1-3 |
p. 269-281
|
artikel
|
| 22 |
The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
|
Swenson, D.
|
|
2006
|
18 |
1-3 |
p. 39-54
|
artikel
|
| 23 |
Thermodynamics and phase diagrams of lead-free solder materials
|
Ipser, H.
|
|
2006
|
18 |
1-3 |
p. 3-17
|
artikel
|
| 24 |
Tin pest issues in lead-free electronic solders
|
Plumbridge, W. J.
|
|
2006
|
18 |
1-3 |
p. 307-318
|
artikel
|
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