| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An Electroless-Ag Reflector Developed for High-Brightness White LEDs
|
Liu, W.C.
|
|
2014
|
43 |
12 |
p. 4602-4609
|
artikel
|
| 2 |
Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions
|
Hamasha, Sa’d
|
|
2014
|
43 |
12 |
p. 4472-4484
|
artikel
|
| 3 |
A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography (μXCT)
|
Mertens, J.C.E.
|
|
2014
|
43 |
12 |
p. 4442-4456
|
artikel
|
| 4 |
Contact Resistance of Flip-Chip Joints in Wearable Electronic Textiles
|
Choi, Jung-Yeol
|
|
2014
|
43 |
12 |
p. 4464-4471
|
artikel
|
| 5 |
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
|
Seo, Wonil
|
|
2014
|
43 |
12 |
p. 4457-4463
|
artikel
|
| 6 |
Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance
|
Lee, Tae-Kyu
|
|
2014
|
43 |
12 |
p. 4522-4531
|
artikel
|
| 7 |
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
|
Liu, Chin-Wei
|
|
2014
|
43 |
12 |
p. 4502-4509
|
artikel
|
| 8 |
Effect of Electric Current on Trijunction Equilibrium and Grain Rotation of Lossy Dielectrics
|
Yang, Fuqian
|
|
2014
|
43 |
12 |
p. 4497-4501
|
artikel
|
| 9 |
Effect of Grain Boundary Misorientation on Electromigrationin Lead-Free Solder Joints
|
Tasooji, Amaneh
|
|
2014
|
43 |
12 |
p. 4386-4394
|
artikel
|
| 10 |
Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Fe-rich Microwires
|
Zhukova, V.
|
|
2014
|
43 |
12 |
p. 4540-4547
|
artikel
|
| 11 |
Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints
|
Zuo, Yong
|
|
2014
|
43 |
12 |
p. 4395-4405
|
artikel
|
| 12 |
Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish
|
Huang, Z.
|
|
2014
|
43 |
12 |
p. 4485-4496
|
artikel
|
| 13 |
Experimental Determination and Thermodynamic Modelingof the Sn-Rich Corner of the Ternary Ni-Pd-Sn PhaseDiagram at 250°C
|
Rahman, Md. Arifur
|
|
2014
|
43 |
12 |
p. 4582-4593
|
artikel
|
| 14 |
High-Performance, Wide-Bandgap Power Electronics
|
McNutt, Ty
|
|
2014
|
43 |
12 |
p. 4552-4559
|
artikel
|
| 15 |
High-Temperature Capacitor Polymer Films
|
Tan, Daniel
|
|
2014
|
43 |
12 |
p. 4569-4575
|
artikel
|
| 16 |
Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing
|
Wang, Chao-hong
|
|
2014
|
43 |
12 |
p. 4594-4601
|
artikel
|
| 17 |
Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density
|
Caccuri, V.
|
|
2014
|
43 |
12 |
p. 4510-4514
|
artikel
|
| 18 |
Nanocopper Based Solder-Free Electronic Assembly
|
Schnabl, K.
|
|
2014
|
43 |
12 |
p. 4515-4521
|
artikel
|
| 19 |
Physicochemical Properties of Sb-Sn-Zn Alloys
|
Gancarz, Tomasz
|
|
2014
|
43 |
12 |
p. 4374-4385
|
artikel
|
| 20 |
Polarization Effects of GaN and AlGaN: Polarization Bound Charge, Band Bending, and Electronic Surface States
|
Eller, Brianna S.
|
|
2014
|
43 |
12 |
p. 4560-4568
|
artikel
|
| 21 |
Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles
|
Ishizaki, Toshitaka
|
|
2014
|
43 |
12 |
p. 4413-4420
|
artikel
|
| 22 |
Pressureless Bonding Using Sputtered Ag Thin Films
|
Oh, Chulmin
|
|
2014
|
43 |
12 |
p. 4406-4412
|
artikel
|
| 23 |
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
|
Kim, Youngseok
|
|
2014
|
43 |
12 |
p. 4428-4434
|
artikel
|
| 24 |
Significance of Nucleation Kinetics in Sn Whisker Formation
|
Chason, E.
|
|
2014
|
43 |
12 |
p. 4435-4441
|
artikel
|
| 25 |
Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
|
Chuang, T. H.
|
|
2014
|
43 |
12 |
p. 4610-4618
|
artikel
|
| 26 |
Strongly Dipolar Polythiourea and Polyurea Dielectrics with High Electrical Breakdown, Low Loss, and High Electrical Energy Density
|
Wu, Shan
|
|
2014
|
43 |
12 |
p. 4548-4551
|
artikel
|
| 27 |
Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages
|
Elmer, John W.
|
|
2014
|
43 |
12 |
p. 4421-4427
|
artikel
|
| 28 |
Temperature-Dependent Giant Magnetoimpedance Effect in Amorphous Soft Magnets
|
Kurniawan, M.
|
|
2014
|
43 |
12 |
p. 4576-4581
|
artikel
|
| 29 |
Tuning of Magnetic Properties and GMI Effect of Co-Based Amorphous Microwires by Annealing
|
Zhukov, Arcady
|
|
2014
|
43 |
12 |
p. 4532-4539
|
artikel
|
| 30 |
Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System
|
Fima, Przemyslaw
|
|
2014
|
43 |
12 |
p. 4365-4373
|
artikel
|
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