| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Simple Process for Synthesis of Ag Nanoparticlesand Sintering of Conductive Ink for Use in Printed Electronics
|
Jung, Inyu
|
|
2011
|
41 |
1 |
p. 115-121
|
artikel
|
| 2 |
A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties
|
Oh, Minsub
|
|
2011
|
41 |
1 |
p. 60-66
|
artikel
|
| 3 |
A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D InterconnectBonding Structures
|
Lee, Byunghoon
|
|
2011
|
41 |
1 |
p. 109-114
|
artikel
|
| 4 |
Conductor Formation Through Phase Transformationin Ti-Oxide Thin Films
|
Liu, Y. S.
|
|
2011
|
41 |
1 |
p. 166-171
|
artikel
|
| 5 |
Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures
|
Lu, C. T.
|
|
2011
|
41 |
1 |
p. 130-137
|
artikel
|
| 6 |
Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films
|
Yeh, Chao-Nan
|
|
2011
|
41 |
1 |
p. 159-165
|
artikel
|
| 7 |
Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials
|
Lin, T.Y.
|
|
2011
|
41 |
1 |
p. 153-158
|
artikel
|
| 8 |
Fast Concurrent Growth of Ni3Sn4 and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates
|
Chung, Bo-Mook
|
|
2011
|
41 |
1 |
p. 44-52
|
artikel
|
| 9 |
Foreword
|
|
|
2011
|
41 |
1 |
p. 1
|
artikel
|
| 10 |
Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System
|
Ho, C. E.
|
|
2011
|
41 |
1 |
p. 2-10
|
artikel
|
| 11 |
Interfacial Reactions in Sn/Fe-xNi Couples
|
Yen, Yee-Wen
|
|
2011
|
41 |
1 |
p. 144-152
|
artikel
|
| 12 |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System
|
Hashiba, M.
|
|
2011
|
41 |
1 |
p. 32-43
|
artikel
|
| 13 |
Low-Resistivity Ru-Ta-C Barriers for Cu Interconnects
|
Fang, J.S.
|
|
2011
|
41 |
1 |
p. 138-143
|
artikel
|
| 14 |
Ni Interdiffusion Coefficient and Activation Energy in Cu6Sn5
|
Huang, Kuan-Chih
|
|
2011
|
41 |
1 |
p. 172-175
|
artikel
|
| 15 |
Optical Properties and Durability of Al2O3-NiP/Al Solar Absorbers Prepared by Electroless Nickel Composite Plating
|
Tsai, T. K.
|
|
2011
|
41 |
1 |
p. 53-59
|
artikel
|
| 16 |
Phase Equilibria of the Sn-Bi-Te Ternary System
|
Chiu, Chen-nan
|
|
2011
|
41 |
1 |
p. 22-31
|
artikel
|
| 17 |
Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses
|
Ho, C. E.
|
|
2011
|
41 |
1 |
p. 11-21
|
artikel
|
| 18 |
The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System
|
Li, D.
|
|
2011
|
41 |
1 |
p. 67-85
|
artikel
|
| 19 |
Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System
|
Gierlotka, Wojciech
|
|
2011
|
41 |
1 |
p. 86-108
|
artikel
|
| 20 |
The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition
|
Fang, J.S.
|
|
2011
|
41 |
1 |
p. 122-129
|
artikel
|
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