| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices
|
Onishi, Takashi
|
|
2011
|
40 |
6 |
p. 1384-1393
|
artikel
|
| 2 |
Characterization and Properties of Nickel Aluminide Nanocrystals in an Alumina Layer for Nonvolatile Memory Applications
|
Kuo, Dong-Hau
|
|
2011
|
40 |
6 |
p. 1345-1349
|
artikel
|
| 3 |
Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation
|
Nguyen, T. T.
|
|
2011
|
40 |
6 |
p. 1409-1415
|
artikel
|
| 4 |
Cr-Doped III–V Nitrides: Potential Candidates for Spintronics
|
Amin, B.
|
|
2011
|
40 |
6 |
p. 1428-1436
|
artikel
|
| 5 |
Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds
|
Huang, Y.
|
|
2011
|
40 |
6 |
p. 1444-1451
|
artikel
|
| 6 |
Effect of Sputtered ZnO Layers on Behavior of Thin-Film Transistors Deposited at Room Temperature in a Nonreactive Atmosphere
|
Medina-Montes, M. I.
|
|
2011
|
40 |
6 |
p. 1461-1469
|
artikel
|
| 7 |
Effects of Annealing on Structural and Electrical Properties of CuInSe2 Thin Films Prepared by Hybrid Sputtering/Evaporation Processes
|
Han, Qifeng
|
|
2011
|
40 |
6 |
p. 1452-1456
|
artikel
|
| 8 |
Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint
|
Ma, Limin
|
|
2011
|
40 |
6 |
p. 1416-1421
|
artikel
|
| 9 |
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit
|
Harris, J.
|
|
2011
|
40 |
6 |
p. 1335-1344
|
artikel
|
| 10 |
Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders
|
Ventura, Tina
|
|
2011
|
40 |
6 |
p. 1403-1408
|
artikel
|
| 11 |
Gettered GaP Substrates for Improved Multijunction Solar Cell Devices
|
Montgomery, K. H.
|
|
2011
|
40 |
6 |
p. 1457-1460
|
artikel
|
| 12 |
Improved Electrical Performance and Reliability of Poly-Si TFTs Fabricated by Drive-In Nickel-Induced Crystallization with Chemical Oxide Layer
|
Lai, Ming-Hui
|
|
2011
|
40 |
6 |
p. 1470-1475
|
artikel
|
| 13 |
Interpretation of Absolute Laser Reflectance During Optical Monitoring of Polycrystalline GaAs Deposition on Quartz Using Metalorganic Chemical Vapor Deposition
|
Clayton, Andrew J.
|
|
2011
|
40 |
6 |
p. 1437-1443
|
artikel
|
| 14 |
Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging
|
Goyal, R. K.
|
|
2011
|
40 |
6 |
p. 1377-1383
|
artikel
|
| 15 |
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper
|
Alarifi, Hani
|
|
2011
|
40 |
6 |
p. 1394-1402
|
artikel
|
| 16 |
Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning
|
Spencer, Todd J.
|
|
2011
|
40 |
6 |
p. 1350-1363
|
artikel
|
| 17 |
Study of Synthesis and Temperature Dependence of DC Conductivity in the Low Temperature Range for Poly(N-Methylaniline)
|
Kapil, Atul
|
|
2011
|
40 |
6 |
p. 1364-1368
|
artikel
|
| 18 |
Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding
|
Danaher, F. D.
|
|
2011
|
40 |
6 |
p. 1422-1427
|
artikel
|
| 19 |
The Effect of Doping with the Polymer Metallic Complex Poly Zinc Acrylate on Superconducting Bulk MgB2
|
Zhang, Zili
|
|
2011
|
40 |
6 |
p. 1369-1376
|
artikel
|
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