| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles
|
Morisada, Y.
|
|
2011
|
40 |
12 |
p. 2398-2402
|
artikel
|
| 2 |
Deep Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Studied by Current-Mode Deep-Level Transient Spectroscopy: Influence of Device Location
|
Fang, Z.-Q.
|
|
2011
|
40 |
12 |
p. 2337-2343
|
artikel
|
| 3 |
Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C
|
Wang, Chao-hong
|
|
2011
|
40 |
12 |
p. 2436-2444
|
artikel
|
| 4 |
Elevated-Temperature Annealing Effects on AlGaN/GaN Heterostructures
|
Ofuonye, Benedict
|
|
2011
|
40 |
12 |
p. 2344-2347
|
artikel
|
| 5 |
Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials
|
Ci, Pengliang
|
|
2011
|
40 |
12 |
p. 2363-2367
|
artikel
|
| 6 |
Grain Orientation Evolution and Deformation Behaviorsin Pb-Free Solder Interconnects Under Mechanical Stresses
|
Chen, H.T.
|
|
2011
|
40 |
12 |
p. 2445-2457
|
artikel
|
| 7 |
High-Vacuum Evaporation of n-CuIn3Se5 Photoabsorber Films for Hybrid PV Structures
|
Adhikari, N.
|
|
2011
|
40 |
12 |
p. 2374-2381
|
artikel
|
| 8 |
Increase in the Thermoelectric Efficiency of the Disordered Phase of Layered Antiferromagnetic CuCrS2
|
Tewari, Girish C.
|
|
2011
|
40 |
12 |
p. 2368-2373
|
artikel
|
| 9 |
Localized Recrystallization Induced by Subgrain Rotationin Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling
|
Chen, Hongtao
|
|
2011
|
40 |
12 |
p. 2470-2479
|
artikel
|
| 10 |
Luminescence of 2,6-Distyrylpyridine-Doped Titania Nanostructured Monoliths
|
Palomino-Merino, R.
|
|
2011
|
40 |
12 |
p. 2388-2391
|
artikel
|
| 11 |
Metal-Assisted Chemical Etching Using Tollen’s Reagent to Deposit Silver Nanoparticle Catalysts for Fabrication of Quasi-ordered Silicon Micro/Nanostructures
|
Geng, Xuewen
|
|
2011
|
40 |
12 |
p. 2480-2485
|
artikel
|
| 12 |
Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause
|
Kumar, Santosh
|
|
2011
|
40 |
12 |
p. 2415-2424
|
artikel
|
| 13 |
One-Step Fabrication of Al/Sn-Bi Core–Shell Spheres via Phase Separation
|
Dai, R.
|
|
2011
|
40 |
12 |
p. 2458-2464
|
artikel
|
| 14 |
Self-Assembly, Optical, and Electrical Properties of a Novel Water-Soluble Perylene Bisimide
|
Boobalan, Gopal
|
|
2011
|
40 |
12 |
p. 2392-2397
|
artikel
|
| 15 |
S-Graded Buffer Layers for Lattice-Mismatched Heteroepitaxial Devices
|
Xhurxhi, S.
|
|
2011
|
40 |
12 |
p. 2348-2354
|
artikel
|
| 16 |
Solder Volume Effects on the Microstructure Evolutionand Shear Fracture Behavior of Ball Grid Array StructureSn-3.0Ag-0.5Cu Solder Interconnects
|
Li, X. P.
|
|
2011
|
40 |
12 |
p. 2425-2435
|
artikel
|
| 17 |
Structural, Optical, and Electrical Properties of Nb-Doped ZnO Thin Films Prepared by Spray Pyrolysis Method
|
Gokulakrishnan, V.
|
|
2011
|
40 |
12 |
p. 2382-2387
|
artikel
|
| 18 |
Study of 4H-SiC JBS Diodes Fabricated with TungstenSchottky Barrier
|
Berthou, M.
|
|
2011
|
40 |
12 |
p. 2355-2362
|
artikel
|
| 19 |
Surface Tension, Density, and Thermal Expansionof (Bi-Ag)eut-Zn Alloys
|
Pstruś, Janusz
|
|
2011
|
40 |
12 |
p. 2465-2469
|
artikel
|
| 20 |
Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model
|
Sasaki, Katsuhiko
|
|
2011
|
40 |
12 |
p. 2403-2414
|
artikel
|
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