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Details for article 16 of 20 found articles
| Title: |
Solder Volume Effects on the Microstructure Evolutionand Shear Fracture Behavior of Ball Grid Array StructureSn-3.0Ag-0.5Cu Solder Interconnects |
| Author: |
Li, X. P. Xia, J. M. Zhou, M. B. Ma, X. Zhang, X. P. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 40 (2011) nr. 12 pages 2425-2435 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 20 found articles
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