| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Computational Study on the Microstructural Evolution and the Change of Electrical Resistivity of Sintered Materials
|
Kim, Hee-Soo
|
|
2008
|
38 |
3 |
p. 475-481
|
artikel
|
| 2 |
Constraining Effects of Lead-Free Solder Joints During Stress Relaxation
|
Zimprich, Peter
|
|
2008
|
38 |
3 |
p. 392-399
|
artikel
|
| 3 |
Effect of pH on Structural and Electrical Properties of Electrodeposited Bi2Te3 Thin Films
|
Suresh, Asaithambi
|
|
2009
|
38 |
3 |
p. 449-452
|
artikel
|
| 4 |
Effect of Rapid Thermal Annealing on Sputtered CaCu3Ti4O12 Thin Films
|
Lin, Shih-Yuan
|
|
2008
|
38 |
3 |
p. 453-459
|
artikel
|
| 5 |
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
|
Zhang, X.F.
|
|
2008
|
38 |
3 |
p. 425-429
|
artikel
|
| 6 |
Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment
|
Budiman, A.S.
|
|
2008
|
38 |
3 |
p. 379-391
|
artikel
|
| 7 |
Germanium-Rich SiGe Nanowires Formed Through Oxidation of Patterned SiGe FINs on Insulator
|
Balakumar, S.
|
|
2009
|
38 |
3 |
p. 443-448
|
artikel
|
| 8 |
Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn
|
Chuang, Tung-Han
|
|
2008
|
38 |
3 |
p. 420-424
|
artikel
|
| 9 |
In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy
|
Sun, Yong
|
|
2008
|
38 |
3 |
p. 400-409
|
artikel
|
| 10 |
Magnetic Patterning of Co/Pt Multilayers by Ga+ Ion Irradiation
|
Wang, Y.G.
|
|
2008
|
38 |
3 |
p. 468-474
|
artikel
|
| 11 |
Microstructure and Characteristics of Thin-Film La0.8Sr0.2Co0.5Ni0.5O3/ZnO:Al Heterocontact CO Sensors Prepared by RF Magnetron Sputtering
|
Yang, Wein-Duo
|
|
2008
|
38 |
3 |
p. 460-467
|
artikel
|
| 12 |
Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress
|
Chen, Yu-jen
|
|
2008
|
38 |
3 |
p. 415-419
|
artikel
|
| 13 |
Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives
|
Inoue, Masahiro
|
|
2008
|
38 |
3 |
p. 430-437
|
artikel
|
| 14 |
Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests
|
You, Taehoon
|
|
2009
|
38 |
3 |
p. 410-414
|
artikel
|
| 15 |
Protein-Assembled Nanocrystal-Based Vertical Flash Memory Devices with Al2O3 Integration
|
Ferdousi, F.
|
|
2009
|
38 |
3 |
p. 438-442
|
artikel
|
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