| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates
|
Wang, Hongqin
|
|
2008
|
37 |
10 |
p. 1640-1647
|
artikel
|
| 2 |
Air-Gaps for High-Performance On-Chip Interconnect Part II: Modeling, Fabrication, and Characterization
|
Park, Seongho
|
|
2008
|
37 |
10 |
p. 1534-1546
|
artikel
|
| 3 |
Air-Gaps for High-Performance On-Chip Interconnect Part I: Improvement in Thermally Decomposable Template
|
Park, SeongHo
|
|
2008
|
37 |
10 |
p. 1524-1533
|
artikel
|
| 4 |
Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu
|
Yang, S.C.
|
|
2008
|
37 |
10 |
p. 1591-1597
|
artikel
|
| 5 |
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
|
Zhang, Ning
|
|
2008
|
37 |
10 |
p. 1631-1639
|
artikel
|
| 6 |
Compliant Substrates for Heteroepitaxial Semiconductor Devices: Theory, Experiment, and Current Directions
|
Ayers, J.E.
|
|
2008
|
37 |
10 |
p. 1511-1523
|
artikel
|
| 7 |
Effect of Ar+ Radiofrequency Plasma Treatment Conditions on the Interfacial Adhesion Energy Between Atomic-Layer-Deposited Al2O3 and Cu Thin Films in Embedded Capacitors
|
Park, Sung-Cheol
|
|
2008
|
37 |
10 |
p. 1565-1573
|
artikel
|
| 8 |
Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich
|
Kuo, Shih-Ming
|
|
2008
|
37 |
10 |
p. 1611-1617
|
artikel
|
| 9 |
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization
|
Lai, Yi-Shao
|
|
2008
|
37 |
10 |
p. 1624-1630
|
artikel
|
| 10 |
Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes
|
Lee, Jun-Ho
|
|
2008
|
37 |
10 |
p. 1648-1652
|
artikel
|
| 11 |
Growth and Characterizations of GaN-Based LEDs Grown on Wet-Etched Stripe-Patterned Sapphire Substrates
|
Ng, Kar Wei
|
|
2008
|
37 |
10 |
p. 1560-1564
|
artikel
|
| 12 |
Growth and Characterizations of GaN-Based LEDs Grown on Wet-Etched Stripe-Patterned Sapphire Substrates
|
Ng, Kar Wei
|
|
|
37 |
10 |
p. 1560-1564
|
artikel
|
| 13 |
Interface Engineering and Direct Bonding of Lithium Tantalate Crystals
|
Torchinsky, Ilya
|
|
2008
|
37 |
10 |
p. 1547-1551
|
artikel
|
| 14 |
Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging
|
Sivasubramaniam, V.
|
|
2008
|
37 |
10 |
p. 1598-1604
|
artikel
|
| 15 |
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
|
Sylvestre, Julien
|
|
2008
|
37 |
10 |
p. 1618-1623
|
artikel
|
| 16 |
Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits
|
Liang, Di
|
|
2008
|
37 |
10 |
p. 1552-1559
|
artikel
|
| 17 |
Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface
|
Chen, Chih-Ming
|
|
2008
|
37 |
10 |
p. 1605-1610
|
artikel
|
| 18 |
Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste
|
Chen, Xu
|
|
2008
|
37 |
10 |
p. 1574-1579
|
artikel
|
| 19 |
Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applications
|
Chung, Chang-Kyu
|
|
2008
|
37 |
10 |
p. 1580-1590
|
artikel
|
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