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Journal description
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Details for article 2 of 19 found articles
| Title: |
Air-Gaps for High-Performance On-Chip Interconnect Part II: Modeling, Fabrication, and Characterization |
| Author: |
Park, Seongho Allen, Sue Ann Bidstrup Kohl, Paul A. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2008) nr. 10 pages 1534-1546 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 19 found articles
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