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Details for article 1 of 19 found articles
| Title: |
A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates |
| Author: |
Wang, Hongqin Zhao, Hui Sekulic, Dusan P. Qian, Yiyu |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2008) nr. 10 pages 1640-1647 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 19 found articles
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