| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric
|
Bhattacharya, Swapan K.
|
|
2007
|
36 |
3 |
p. 242-244
|
artikel
|
| 2 |
Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects
|
Tsukimoto, S.
|
|
2007
|
36 |
3 |
p. 258-265
|
artikel
|
| 3 |
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies
|
NOUSIAINEN, O.
|
|
2007
|
36 |
3 |
p. 232-241
|
artikel
|
| 4 |
Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies
|
Jang, J.W.
|
|
2007
|
36 |
3 |
p. 207-213
|
artikel
|
| 5 |
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds
|
Williams, M.E.
|
|
2007
|
36 |
3 |
p. 214-219
|
artikel
|
| 6 |
Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages
|
Lam, D.C.C.
|
|
2007
|
36 |
3 |
p. 226-231
|
artikel
|
| 7 |
Interfacial Chemistry of InP/GaAs Bonded Pairs
|
Liu, N.
|
|
2007
|
36 |
3 |
p. 179-190
|
artikel
|
| 8 |
Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate
|
Ding, Shi-Jin
|
|
2007
|
36 |
3 |
p. 253-257
|
artikel
|
| 9 |
Microstructure of External Stress Whiskers and Mechanical Indentation Test Method
|
Moriuchi, Hiroyuki
|
|
2007
|
36 |
3 |
p. 220-225
|
artikel
|
| 10 |
Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C
|
Chen, S.-W.
|
|
2007
|
36 |
3 |
p. 197-206
|
artikel
|
| 11 |
Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process
|
Hung, Kun Ming
|
|
2007
|
36 |
3 |
p. 245-252
|
artikel
|
| 12 |
Understanding the Effects of Stress on the Crystallization of Amorphous Silicon
|
Cai, Li
|
|
2007
|
36 |
3 |
p. 191-196
|
artikel
|
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