| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness
|
Chang, Chien Wei
|
|
2007
|
36 |
11 |
p. 1455-1461
|
artikel
|
| 2 |
Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
|
Cho, Moon Gi
|
|
2007
|
36 |
11 |
p. 1501-1509
|
artikel
|
| 3 |
Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution
|
Liu, Chih-Yao
|
|
2007
|
36 |
11 |
p. 1531-1535
|
artikel
|
| 4 |
Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon
|
Tsai, T.K.
|
|
2007
|
36 |
11 |
p. 1408-1414
|
artikel
|
| 5 |
Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2 Plasmas for Flip-Chip Bumping
|
Lin, Yung-Sen
|
|
2007
|
36 |
11 |
p. 1483-1488
|
artikel
|
| 6 |
Evaluation of DC-sputtered Glassy TaCoN Thin Film for Copper Metallization
|
Fang, Jau-Shiung
|
|
2007
|
36 |
11 |
p. 1462-1468
|
artikel
|
| 7 |
Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration
|
Li, C.H.
|
|
2007
|
36 |
11 |
p. 1489-1494
|
artikel
|
| 8 |
Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents
|
Lim, Jun Hyung
|
|
2007
|
36 |
11 |
p. 1510-1515
|
artikel
|
| 9 |
Foreword
|
Chen, Sinn-wen
|
|
2007
|
36 |
11 |
p. 1407
|
artikel
|
| 10 |
Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints
|
Hsiao, Li-Yin
|
|
2007
|
36 |
11 |
p. 1476-1482
|
artikel
|
| 11 |
Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates
|
Yang, Ching-Feng
|
|
2007
|
36 |
11 |
p. 1524-1530
|
artikel
|
| 12 |
Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint
|
Lin, Yung-Chi
|
|
2007
|
36 |
11 |
p. 1469-1475
|
artikel
|
| 13 |
Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process
|
Lee, Sung-Ki
|
|
2007
|
36 |
11 |
p. 1442-1447
|
artikel
|
| 14 |
Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections
|
Schmetterer, Clemens
|
|
2007
|
36 |
11 |
p. 1415-1428
|
artikel
|
| 15 |
Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness
|
Lu, Min-Hsien
|
|
2007
|
36 |
11 |
p. 1448-1454
|
artikel
|
| 16 |
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications
|
Song, Jenn-Ming
|
|
2007
|
36 |
11 |
p. 1516-1523
|
artikel
|
| 17 |
The Effect of Thermomigration on Phase Coarsening in a Eutectic SnPb Alloy
|
Chuang, Y.C.
|
|
2007
|
36 |
11 |
p. 1495-1500
|
artikel
|
| 18 |
Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System
|
Seo, Sun-Kyoung
|
|
2007
|
36 |
11 |
p. 1536-1544
|
artikel
|
| 19 |
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System
|
Liu, X. J.
|
|
|
36 |
11 |
p. 1429-1441
|
artikel
|
| 20 |
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System
|
Liu, X. J.
|
|
2007
|
36 |
11 |
p. 1429-1441
|
artikel
|
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