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                             47 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability Anderson, I. E.
 2001
 30 9 p. 1050-1059
 artikel
2 Application of an asymmetrical four point bend shear test to solder joints Unal, Ö.
30 9 p. 1206-1213
 artikel
3 Application of an asymmetrical four point bend shear test to solder joints Unal, Ö.
 2001
 30 9 p. 1206-1213
 artikel
4 Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach Kariya, Yoshiharu
 2001
 30 9 p. 1184-1189
 artikel
5 Constitutive and damage model for a lead-free solder Wen, Shengmin
30 9 p. 1190-1196
 artikel
6 Constitutive and damage model for a lead-free solder Wen, Shengmin
 2001
 30 9 p. 1190-1196
 artikel
7 Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles Guo, F.
 2001
 30 9 p. 1222-1227
 artikel
8 Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles Guo, F.
30 9 p. 1222-1227
 artikel
9 Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys Wade, Noboru
 2001
 30 9 p. 1228-1231
 artikel
10 Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints Snugovsky, P.
 2001
 30 9 p. 1262-1270
 artikel
11 Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system Liu, X. J.
30 9 p. 1093-1103
 artikel
12 Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system Liu, X. J.
 2001
 30 9 p. 1093-1103
 artikel
13 Foreword Kang, Sung K.
 2001
 30 9 p. 1049
 artikel
14 Influence of alloy composition on fillet-lifting phenomenon in Sn-Ag-Bi alloys Takao, H.
 2001
 30 9 p. 1060-1067
 artikel
15 Interfacial reactions between a Pb-Free solder and die backside metallizations Ghosh, G.
 2001
 30 9 p. 1145-1151
 artikel
16 Interfacial reactions in the Sn-Ag/Au couples Chen, Sinn-Wen
 2001
 30 9 p. 1133-1137
 artikel
17 Intermetallic growth of wire-bond at 175°C high temperature aging Chang, Hen-So
 2001
 30 9 p. 1171-1177
 artikel
18 Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization Park, J. Y.
 2001
 30 9 p. 1165-1170
 artikel
19 Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface Lee, Jong-Hyun
 2001
 30 9 p. 1138-1144
 artikel
20 Laser soldering for chip-on-glass mounting in flat panel display application Lee, Jong-Hyun
30 9 p. 1255-1261
 artikel
21 Laser soldering for chip-on-glass mounting in flat panel display application Lee, Jong-Hyun
 2001
 30 9 p. 1255-1261
 artikel
22 Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate Young, C. C.
30 9 p. 1241-1248
 artikel
23 Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate Young, C. C.
 2001
 30 9 p. 1241-1248
 artikel
24 Morphological stability of solder reaction products in flip chip technology Tu, K. N.
 2001
 30 9 p. 1129-1132
 artikel
25 Observations of microstructural coarsening in micro flip-chip solder joints Barney, Monica M.
30 9 p. 1088-1092
 artikel
26 Observations of microstructural coarsening in micro flip-chip solder joints Barney, Monica M.
 2001
 30 9 p. 1088-1092
 artikel
27 Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles Guo, F.
 2001
 30 9 p. 1073-1082
 artikel
28 Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging Djurfors, B.
 2001
 30 9 p. 1249-1254
 artikel
29 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu, C. M.
30 9 p. 1152-1156
 artikel
30 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu, C. M.
 2001
 30 9 p. 1152-1156
 artikel
31 Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests Cook, B. A.
 2001
 30 9 p. 1214-1221
 artikel
32 Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact Lin, Kwang-Lung
 2001
 30 9 p. 1068-1072
 artikel
33 Stress relaxation behavior of composite and eutectic Sn-Ag solder joints Jadhav, S. G.
 2001
 30 9 p. 1197-1205
 artikel
34 Stress relaxation behavior of composite and eutectic Sn-Ag solder joints Jadhav, S. G.
30 9 artikel
35 Studies of the Ag-In phase diagram and surface tension measurements Moser, Z.
30 9 p. 1120-1128
 artikel
36 Studies of the Ag-In phase diagram and surface tension measurements Moser, Z.
 2001
 30 9 p. 1120-1128
 artikel
37 Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys Moser, Z.
 2001
 30 9 p. 1104-1111
 artikel
38 Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys Moser, Z.
30 9 p. 1104-1111
 artikel
39 The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders Chuang, C. M.
 2001
 30 9 p. 1232-1240
 artikel
40 The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders Chuang, C. M.
30 9 p. 1232-1240
 artikel
41 The creep of lead-free solders at elevated temperatures Plumbridge, W. J.
30 9 p. 1178-1183
 artikel
42 The creep of lead-free solders at elevated temperatures Plumbridge, W. J.
 2001
 30 9 p. 1178-1183
 artikel
43 The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure Zribi, A.
 2001
 30 9 p. 1157-1164
 artikel
44 The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au Song, H. G.
30 9 p. 1083-1087
 artikel
45 The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au Song, H. G.
 2001
 30 9 p. 1083-1087
 artikel
46 Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems Lee, Jong Ho
 2001
 30 9 p. 1112-1119
 artikel
47 Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems Lee, Jong Ho
30 9 p. 1112-1119
 artikel
                             47 gevonden resultaten
 
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