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Journal description
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Details for article 17 of 47 found articles
| Title: |
Intermetallic growth of wire-bond at 175°C high temperature aging |
| Author: |
Chang, Hen-So Pon, J. X. Hsieh, Ker-Chang Chen, C. C. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 30 (2001) nr. 9 pages 1171-1177 |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 47 found articles
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