| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying
|
Wu, C. M. L.
|
|
2000
|
29 |
8 |
p. 1015-1020
|
article
|
| 2 |
Effect of NO annealing conditions on electrical characteristics of n-type 4H-SiC MOS capacitors
|
Li, H. -F.
|
|
2000
|
29 |
8 |
p. 1027-1032
|
article
|
| 3 |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y. M.
|
|
2000
|
29 |
8 |
p. 1047-1051
|
article
|
| 4 |
Luminescent chemically-etched porous poly-crystalline silicon on insulating substrates
|
Pease, T. J.
|
|
2000
|
29 |
8 |
p. 1033-1037
|
article
|
| 5 |
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging
|
Huang, M. L.
|
|
2000
|
29 |
8 |
p. 1021-1026
|
article
|
| 6 |
Research on applying direct plating to additive process for printed circuit board
|
Chiang, Yi-Ying
|
|
2000
|
29 |
8 |
p. 1001-1006
|
article
|
| 7 |
Segregation of phosphorus and germanium to grain boundaries in chemical vapor deposited silicon-germanium films determined by scanning transmission electron microscopy
|
Qin, W.
|
|
2000
|
29 |
8 |
p. L13-L17
|
article
|
| 8 |
Sol-gel processed silica/titania/ÿ-Glycidoxypropyltrimethoxysilane composite materials for photonic applications
|
Que, Wenxiu
|
|
|
29 |
8 |
p. 1052-1058
|
article
|
| 9 |
Sol-gel processed silica/titania/ÿ-Glycidoxypropyltrimethoxysilane composite materials for photonic applications
|
Que, Wenxiu
|
|
2000
|
29 |
8 |
p. 1052-1058
|
article
|
| 10 |
The microstructure of ultrafine eutectic Au-Sn solder joints on Cu
|
Song, H. G.
|
|
2000
|
29 |
8 |
p. 1038-1046
|
article
|
| 11 |
The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow
|
Chen, Chun-Jen
|
|
2000
|
29 |
8 |
p. 1007-1014
|
article
|
| 12 |
Visible light-emitting diodes grown on optimized ∇x[InxGa1−x]P/GaP epitaxial transparent substrates with controlled dislocation density
|
Kim, Andrew Y.
|
|
2000
|
29 |
8 |
p. L9-L12
|
article
|
Journal description