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Journal description
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Details for article 5 of 12 found articles
| Title: |
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging |
| Author: |
Huang, M. L. Wu, C. M. L. Lai, J. K. L. Chan, Y. C. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 29 (2000) nr. 8 pages 1021-1026 |
| Year: |
2000 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 12 found articles
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