nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comparison of MOS processes for VLSI. Part I
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
2 |
Advances in microelectronics packaging and interconnection technologies —towards the new generation of hybrid microelectronics
|
Sinnadurai, Nihal |
|
1985 |
16 |
5 |
p. 31-43 13 p. |
artikel |
3 |
Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
4 |
Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
5 |
Ammonium persulfate as a stripping and cleaning oxidant
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
6 |
Analysis of thin film fire sensors
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
7 |
A new active-C oscillator
|
Taher Abuelma' Atti, Muhammad |
|
1985 |
16 |
5 |
p. 18-21 4 p. |
artikel |
8 |
An experimental approach to vapor phase reflow solder assembly
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
9 |
A novel memory device for VLSI E2 prom
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
10 |
Application of electron beams in thermal processing of semiconductor materials and devices
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
11 |
Bipolar device packaging-electrical, thermal, and mechanical stress considerations
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
12 |
Bipolar gate array delivers fast signal processing
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
13 |
Chromium redistribution in ion-implanted GaAs
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
14 |
Contamination prevention and protection for process gases
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
15 |
Control of polysilicon film properties
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
16 |
Deposition and patterning of the tungsten and tantaium polycides
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
17 |
Designing for testability
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
18 |
Design system for semi-custom VLSI cicuits
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
19 |
Detection and accelerated testing of vibration-induced connector wear
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
20 |
Direct attachment of leadless chip carriers to organic matrix printed wiring boards
|
|
|
1985 |
16 |
5 |
p. 47-48 2 p. |
artikel |
21 |
Editorial
|
Butcher, John |
|
1985 |
16 |
5 |
p. 3- 1 p. |
artikel |
22 |
Electrical characteristics of large scale integration (LSI) Mosfet's at very high temperatures. Part I; theory
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
23 |
Electrical characteristics of large-scale integration silicon MOSFET's at very high temperatures, Part III: modelling and circuit behaviour
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
24 |
Electron beam resist systems—a critical review of recent developments
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
25 |
Failures induced by electromigration in ECL 100k devices
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
26 |
Fast C-MOS logic bids for TTL sockets in most systems
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
27 |
Fatigue life of leadless chip carrier solder joints during power cycling
|
|
|
1985 |
16 |
5 |
p. 49- 1 p. |
artikel |
28 |
Forthcoming events
|
|
|
1985 |
16 |
5 |
p. 55-58 4 p. |
artikel |
29 |
Fretting corrosion of solder-coated electrical contacts
|
|
|
1985 |
16 |
5 |
p. 52-53 2 p. |
artikel |
30 |
High pinout IC packaging and the density advantage of surface mounting
|
|
|
1985 |
16 |
5 |
p. 49- 1 p. |
artikel |
31 |
Impact of custom VLSI technology
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
32 |
Improved electrical performance required for future MOS packaging
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
33 |
Improved planar isolation with buried-channel MOS FET's
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
34 |
ITT's testability analysis program
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
35 |
Management of AICI3 in plasma etching aluminium and its alloys
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
36 |
Methodologies for full custom VLSI design
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
37 |
Modelling of discrete semiconductor devices
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
38 |
Modular approach to C-MOS technology tailors process to application
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
39 |
Multilayer resist processes and laternatives
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
40 |
Noise investigations on thick film resistors
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
41 |
Non-inverting regenerative CMOS logic circuits
|
Bundalo, Zlatko V. |
|
1985 |
16 |
5 |
p. 5-17 13 p. |
artikel |
42 |
Nonlinear distortion in current-feedback amplifiers
|
Martinez, Pedro A. |
|
1985 |
16 |
5 |
p. 22-30 9 p. |
artikel |
43 |
[No title]
|
Howson, M. |
|
1985 |
16 |
5 |
p. 45- 1 p. |
artikel |
44 |
[No title]
|
Fletcher, A.E. |
|
1985 |
16 |
5 |
p. 45- 1 p. |
artikel |
45 |
Power bipolar devices
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
46 |
Power M.O.S. devices
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
47 |
Properties of metal-semiconductor contacts-II. Numerical solutions for intrinsic material
|
|
|
1985 |
16 |
5 |
p. 51- 1 p. |
artikel |
48 |
Research and development
|
|
|
1985 |
16 |
5 |
p. 59-63 5 p. |
artikel |
49 |
Roop
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
50 |
Selective reactive ion etching of silicon dioxide
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
51 |
Solder pastes for microelectronics
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
52 |
Square 25-thou posts/receptacles dorminate US interconnection market
|
|
|
1985 |
16 |
5 |
p. 48- 1 p. |
artikel |
53 |
Status and prospects for gallium arsenide technology
|
|
|
1985 |
16 |
5 |
p. 46- 1 p. |
artikel |
54 |
Switch failure in a two-unit standby system with better utilization of units
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
55 |
The density of states at GaAs/native oxide interfaces
|
|
|
1985 |
16 |
5 |
p. 53- 1 p. |
artikel |
56 |
The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates
|
|
|
1985 |
16 |
5 |
p. 49- 1 p. |
artikel |
57 |
The gold donor and acceptor level in p-type silicon
|
|
|
1985 |
16 |
5 |
p. 54- 1 p. |
artikel |
58 |
Thermal studies on pin grid array packages for high density LSI and VLSI logic circuits
|
|
|
1985 |
16 |
5 |
p. 49-50 2 p. |
artikel |
59 |
The role of inorganic materials in dry-processed resist technology
|
|
|
1985 |
16 |
5 |
p. 50- 1 p. |
artikel |
60 |
Thin film processing of hybrid ICs
|
|
|
1985 |
16 |
5 |
p. 49- 1 p. |
artikel |
61 |
Transition to one micro technology: Part 2
|
|
|
1985 |
16 |
5 |
p. 47- 1 p. |
artikel |
62 |
Trends in medical electronics using surface mounted components and hybrids
|
|
|
1985 |
16 |
5 |
p. 49- 1 p. |
artikel |
63 |
Uniform plasma etching of printed circuit boards
|
|
|
1985 |
16 |
5 |
p. 52- 1 p. |
artikel |
64 |
Work function measurements during a growth of ultra thin films of SiO2 on characterized silicon surfaces
|
|
|
1985 |
16 |
5 |
p. 54- 1 p. |
artikel |