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                             64 results found
no title author magazine year volume issue page(s) type
1 A comparison of MOS processes for VLSI. Part I
16 5 p. 47
 article
2 Advances in microelectronics packaging and interconnection technologies —towards the new generation of hybrid microelectronics Sinnadurai, Nihal
16 5 p. 31-43
 article
3 Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II
16 5 p. 51
 article
4 Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II
16 5 p. 51
 article
5 Ammonium persulfate as a stripping and cleaning oxidant
16 5 p. 50
 article
6 Analysis of thin film fire sensors
16 5 p. 48
 article
7 A new active-C oscillator Taher Abuelma' Atti, Muhammad
16 5 p. 18-21
 article
8 An experimental approach to vapor phase reflow solder assembly
16 5 p. 52
 article
9 A novel memory device for VLSI E2 prom
16 5 p. 46
 article
10 Application of electron beams in thermal processing of semiconductor materials and devices
16 5 p. 52
 article
11 Bipolar device packaging-electrical, thermal, and mechanical stress considerations
16 5 p. 47
 article
12 Bipolar gate array delivers fast signal processing
16 5 p. 46
 article
13 Chromium redistribution in ion-implanted GaAs
16 5 p. 52
 article
14 Contamination prevention and protection for process gases
16 5 p. 50
 article
15 Control of polysilicon film properties
16 5 p. 51
 article
16 Deposition and patterning of the tungsten and tantaium polycides
16 5 p. 51
 article
17 Designing for testability
16 5 p. 53
 article
18 Design system for semi-custom VLSI cicuits
16 5 p. 47
 article
19 Detection and accelerated testing of vibration-induced connector wear
16 5 p. 53
 article
20 Direct attachment of leadless chip carriers to organic matrix printed wiring boards
16 5 p. 47-48
 article
21 Editorial Butcher, John
16 5 p. 3
 article
22 Electrical characteristics of large scale integration (LSI) Mosfet's at very high temperatures. Part I; theory
16 5 p. 53
 article
23 Electrical characteristics of large-scale integration silicon MOSFET's at very high temperatures, Part III: modelling and circuit behaviour
16 5 p. 53
 article
24 Electron beam resist systems—a critical review of recent developments
16 5 p. 51
 article
25 Failures induced by electromigration in ECL 100k devices
16 5 p. 50
 article
26 Fast C-MOS logic bids for TTL sockets in most systems
16 5 p. 46
 article
27 Fatigue life of leadless chip carrier solder joints during power cycling
16 5 p. 49
 article
28 Forthcoming events
16 5 p. 55-58
 article
29 Fretting corrosion of solder-coated electrical contacts
16 5 p. 52-53
 article
30 High pinout IC packaging and the density advantage of surface mounting
16 5 p. 49
 article
31 Impact of custom VLSI technology
16 5 p. 46
 article
32 Improved electrical performance required for future MOS packaging
16 5 p. 47
 article
33 Improved planar isolation with buried-channel MOS FET's
16 5 p. 47
 article
34 ITT's testability analysis program
16 5 p. 53
 article
35 Management of AICI3 in plasma etching aluminium and its alloys
16 5 p. 51
 article
36 Methodologies for full custom VLSI design
16 5 p. 47
 article
37 Modelling of discrete semiconductor devices
16 5 p. 48
 article
38 Modular approach to C-MOS technology tailors process to application
16 5 p. 46
 article
39 Multilayer resist processes and laternatives
16 5 p. 52
 article
40 Noise investigations on thick film resistors
16 5 p. 48
 article
41 Non-inverting regenerative CMOS logic circuits Bundalo, Zlatko V.
16 5 p. 5-17
 article
42 Nonlinear distortion in current-feedback amplifiers Martinez, Pedro A.
16 5 p. 22-30
 article
43 [No title] Howson, M.
16 5 p. 45
 article
44 [No title] Fletcher, A.E.
16 5 p. 45
 article
45 Power bipolar devices
16 5 p. 48
 article
46 Power M.O.S. devices
16 5 p. 48
 article
47 Properties of metal-semiconductor contacts-II. Numerical solutions for intrinsic material
16 5 p. 51
 article
48 Research and development
16 5 p. 59-63
 article
49 Roop
16 5 p. 46
 article
50 Selective reactive ion etching of silicon dioxide
16 5 p. 52
 article
51 Solder pastes for microelectronics
16 5 p. 50
 article
52 Square 25-thou posts/receptacles dorminate US interconnection market
16 5 p. 48
 article
53 Status and prospects for gallium arsenide technology
16 5 p. 46
 article
54 Switch failure in a two-unit standby system with better utilization of units
16 5 p. 50
 article
55 The density of states at GaAs/native oxide interfaces
16 5 p. 53
 article
56 The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates
16 5 p. 49
 article
57 The gold donor and acceptor level in p-type silicon
16 5 p. 54
 article
58 Thermal studies on pin grid array packages for high density LSI and VLSI logic circuits
16 5 p. 49-50
 article
59 The role of inorganic materials in dry-processed resist technology
16 5 p. 50
 article
60 Thin film processing of hybrid ICs
16 5 p. 49
 article
61 Transition to one micro technology: Part 2
16 5 p. 47
 article
62 Trends in medical electronics using surface mounted components and hybrids
16 5 p. 49
 article
63 Uniform plasma etching of printed circuit boards
16 5 p. 52
 article
64 Work function measurements during a growth of ultra thin films of SiO2 on characterized silicon surfaces
16 5 p. 54
 article
                             64 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands