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                                       Details for article 2 of 64 found articles
 
 
  Advances in microelectronics packaging and interconnection technologies —towards the new generation of hybrid microelectronics
 
 
Title: Advances in microelectronics packaging and interconnection technologies —towards the new generation of hybrid microelectronics
Author: Sinnadurai, Nihal
Appeared in: Microelectronics journal
Paging: Volume 16 (1985) nr. 5 pages 13 p.
Year: 1985
Contents:
Publisher: Benn Electronics Publications Ltd, Luton
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 64 found articles
 
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