| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fast fault injection platform of multiple SEUs for SRAM-based FPGAs
|
Zhang, Rongsheng
|
|
2018
|
82 |
C |
p. 147-152
|
artikel
|
| 2 |
A portable high-density absolute-measure NIRS imager for detecting prefrontal lobe activity under fatigue driving
|
Zhao, Yue
|
|
2018
|
82 |
C |
p. 197-203
|
artikel
|
| 3 |
A review of pulsed NBTI in P-channel power VDMOSFETs
|
Danković, D.
|
|
2018
|
82 |
C |
p. 28-36
|
artikel
|
| 4 |
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes
|
Kao, Chin-Li
|
|
2018
|
82 |
C |
p. 204-212
|
artikel
|
| 5 |
60Co gamma radiation total ionizing dose combined with conducted electromagnetic interference studies in BJTs
|
Lawal, Olarewaju Mubashiru
|
|
2018
|
82 |
C |
p. 159-164
|
artikel
|
| 6 |
Editorial
|
|
|
2018
|
82 |
C |
p. iii
|
artikel
|
| 7 |
Editorial Board
|
|
|
2018
|
82 |
C |
p. ii
|
artikel
|
| 8 |
Experimental study on optical-thermal associated characteristics of LED car lamps under the action of ionic wind
|
Wang, Jing
|
|
2018
|
82 |
C |
p. 113-123
|
artikel
|
| 9 |
Fault diagnosis for the motor drive system of urban transit based on improved Hidden Markov Model
|
Darong, Huang
|
|
2018
|
82 |
C |
p. 179-189
|
artikel
|
| 10 |
Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction
|
Conseil-Gudla, H.
|
|
2018
|
82 |
C |
p. 136-146
|
artikel
|
| 11 |
Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws
|
Martin, Carmen
|
|
2018
|
82 |
C |
p. 213-223
|
artikel
|
| 12 |
Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads
|
Li, W.Y.
|
|
2018
|
82 |
C |
p. 224-227
|
artikel
|
| 13 |
Lifetime estimation of IGBT modules for MMC-HVDC application
|
Wang, Longjun
|
|
2018
|
82 |
C |
p. 90-99
|
artikel
|
| 14 |
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via
|
Watanabe, Kazuki
|
|
2018
|
82 |
C |
p. 20-27
|
artikel
|
| 15 |
Micro-Raman spectroscopy applied in crystal structure analysis on the ESD failure mechanism of SiC JBS diodes
|
Jia, Yunpeng
|
|
2018
|
82 |
C |
p. 37-41
|
artikel
|
| 16 |
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
|
Ali, Bakhtiar
|
|
2018
|
82 |
C |
p. 171-178
|
artikel
|
| 17 |
Mössbauer studies of β → α phase transition in Sn-rich solder alloys
|
Zachariasz, Piotr
|
|
2018
|
82 |
C |
p. 165-170
|
artikel
|
| 18 |
NBTI: Experimental investigation, physical modelling, circuit aging simulations and verification
|
Schlünder, C.
|
|
2018
|
82 |
C |
p. 1-10
|
artikel
|
| 19 |
Parameter driven monitoring for a flip-chip LED module under power cycling condition
|
Magnien, J.
|
|
2018
|
82 |
C |
p. 84-89
|
artikel
|
| 20 |
Review of bias-temperature instabilities at the III-N/dielectric interface
|
Ostermaier, C.
|
|
2018
|
82 |
C |
p. 62-83
|
artikel
|
| 21 |
Study and analysis of DR-VCO for rad-hardness in type II third order CPLL
|
Karthigeyan, K.A.
|
|
2018
|
82 |
C |
p. 190-196
|
artikel
|
| 22 |
Study of microwave damage effect on HEMT low noise amplifier under different drain voltage bias
|
Yan, Tao
|
|
2018
|
82 |
C |
p. 228-234
|
artikel
|
| 23 |
Study of the operation and SET robustness of a CMOS pulse stretching circuit
|
Andjelkovic, Marko
|
|
2018
|
82 |
C |
p. 100-112
|
artikel
|
| 24 |
Synergistic effects of NPN transistors caused by combined proton irradiations with different energies
|
Li, Xingji
|
|
2018
|
82 |
C |
p. 130-135
|
artikel
|
| 25 |
Technology scaling implications for BTI reliability
|
Ramey, S.M.
|
|
2018
|
82 |
C |
p. 42-50
|
artikel
|
| 26 |
The effect of epoxy/glass interfaces on CAF failures in printed circuit boards
|
Sood, Bhanu
|
|
2018
|
82 |
C |
p. 235-243
|
artikel
|
| 27 |
The effect of ionization and displacement damage on minority carrier lifetime
|
Yang, Jianqun
|
|
2018
|
82 |
C |
p. 124-129
|
artikel
|
| 28 |
Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop
|
Gao, Bing
|
|
2018
|
82 |
C |
p. 51-61
|
artikel
|
| 29 |
The temperature and oxygen vacancy effects on the diffusion coefficient and ionic conductivity in ferroelectric BaTiO3 nanowires; A molecular dynamics study
|
Gholipour Shahraki, Mehran
|
|
2018
|
82 |
C |
p. 153-158
|
artikel
|
| 30 |
Topological variation on sub-20 nm double-gate inversion and Junctionless-FinFET based 6T-SRAM circuits and its SEU radiation performance
|
Nilamani, S.
|
|
2018
|
82 |
C |
p. 11-19
|
artikel
|
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