| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accurate lifetime prediction for channel hot carrier stress on sub-1nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer
|
Luo, Weichun
|
|
2016
|
62 |
C |
p. 70-73
4 p.
|
artikel
|
| 2 |
A concise study of neutron irradiation effects on power MOSFETs and IGBTs
|
Baghaie Yazdi, M.
|
|
2016
|
62 |
C |
p. 74-78
5 p.
|
artikel
|
| 3 |
An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages
|
Poshtan, Emad A.
|
|
2016
|
62 |
C |
p. 18-25
8 p.
|
artikel
|
| 4 |
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded
|
Pecht, Michael
|
|
2016
|
62 |
C |
p. 113-123
11 p.
|
artikel
|
| 5 |
Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints
|
Bosco, Nick
|
|
2016
|
62 |
C |
p. 124-129
6 p.
|
artikel
|
| 6 |
Editorial Board
|
|
|
2016
|
62 |
C |
p. IFC-
1 p.
|
artikel
|
| 7 |
Experimental identification of thermal induced warpage in polymer–metal composite films
|
Li, Heng
|
|
2016
|
62 |
C |
p. 141-147
7 p.
|
artikel
|
| 8 |
Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints
|
Yang, Chaoran
|
|
2016
|
62 |
C |
p. 130-140
11 p.
|
artikel
|
| 9 |
Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe
|
Driss, Améni
|
|
2016
|
62 |
C |
p. 102-112
11 p.
|
artikel
|
| 10 |
Fault prognostic of electronics based on optimal multi-order particle filter
|
Jiang, Yuanyuan
|
|
2016
|
62 |
C |
p. 167-177
11 p.
|
artikel
|
| 11 |
Gate length dependence of bias temperature instability behavior in short channel SOI MOSFETs
|
Wu, Wangran
|
|
2016
|
62 |
C |
p. 79-81
3 p.
|
artikel
|
| 12 |
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur
|
|
2016
|
62 |
C |
p. 1-3
3 p.
|
artikel
|
| 13 |
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
|
Lall, Pradeep
|
|
2016
|
62 |
C |
p. 4-17
14 p.
|
artikel
|
| 14 |
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor
|
Palczynska, Alicja
|
|
2016
|
62 |
C |
p. 58-62
5 p.
|
artikel
|
| 15 |
Lumen maintenance predictions for LED packages
|
van Driel, W.D.
|
|
2016
|
62 |
C |
p. 39-44
6 p.
|
artikel
|
| 16 |
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging
|
Adli, A.R. Rezaie
|
|
2016
|
62 |
C |
p. 26-38
13 p.
|
artikel
|
| 17 |
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
|
Fellner, Klaus
|
|
2016
|
62 |
C |
p. 148-155
8 p.
|
artikel
|
| 18 |
Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices
|
Barink, M.
|
|
2016
|
62 |
C |
p. 45-49
5 p.
|
artikel
|
| 19 |
Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters
|
Batunlu, C.
|
|
2016
|
62 |
C |
p. 82-90
9 p.
|
artikel
|
| 20 |
Reliability analysis of spin transfer torque based look up tables under process variations and NBTI aging
|
Kuttappa, Ragh
|
|
2016
|
62 |
C |
p. 156-166
11 p.
|
artikel
|
| 21 |
Splitter plate application on the circular and square pin fin heat sinks
|
Sajedi, R.
|
|
2016
|
62 |
C |
p. 91-101
11 p.
|
artikel
|
| 22 |
The effect of annealing temperature on the electronic parameters and carrier transport mechanism of Pt/n-type Ge Schottky diode
|
Guo, Erjuan
|
|
2016
|
62 |
C |
p. 63-69
7 p.
|
artikel
|
| 23 |
Thermo-mechanical effects in Majorana type quantum devices
|
Gielen, A.W.J.
|
|
2016
|
62 |
C |
p. 50-57
8 p.
|
artikel
|
| 24 |
Using instruction result locality and re-execution to mitigate silent data corruptions
|
Tajary, Alireza
|
|
2016
|
62 |
C |
p. 178-190
13 p.
|
artikel
|
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