no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Accurate lifetime prediction for channel hot carrier stress on sub-1nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer
|
Luo, Weichun |
|
2016 |
62 |
C |
p. 70-73 4 p. |
article |
2 |
A concise study of neutron irradiation effects on power MOSFETs and IGBTs
|
Baghaie Yazdi, M. |
|
2016 |
62 |
C |
p. 74-78 5 p. |
article |
3 |
An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages
|
Poshtan, Emad A. |
|
2016 |
62 |
C |
p. 18-25 8 p. |
article |
4 |
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded
|
Pecht, Michael |
|
2016 |
62 |
C |
p. 113-123 11 p. |
article |
5 |
Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints
|
Bosco, Nick |
|
2016 |
62 |
C |
p. 124-129 6 p. |
article |
6 |
Editorial Board
|
|
|
2016 |
62 |
C |
p. IFC- 1 p. |
article |
7 |
Experimental identification of thermal induced warpage in polymer–metal composite films
|
Li, Heng |
|
2016 |
62 |
C |
p. 141-147 7 p. |
article |
8 |
Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints
|
Yang, Chaoran |
|
2016 |
62 |
C |
p. 130-140 11 p. |
article |
9 |
Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe
|
Driss, Améni |
|
2016 |
62 |
C |
p. 102-112 11 p. |
article |
10 |
Fault prognostic of electronics based on optimal multi-order particle filter
|
Jiang, Yuanyuan |
|
2016 |
62 |
C |
p. 167-177 11 p. |
article |
11 |
Gate length dependence of bias temperature instability behavior in short channel SOI MOSFETs
|
Wu, Wangran |
|
2016 |
62 |
C |
p. 79-81 3 p. |
article |
12 |
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur |
|
2016 |
62 |
C |
p. 1-3 3 p. |
article |
13 |
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
|
Lall, Pradeep |
|
2016 |
62 |
C |
p. 4-17 14 p. |
article |
14 |
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor
|
Palczynska, Alicja |
|
2016 |
62 |
C |
p. 58-62 5 p. |
article |
15 |
Lumen maintenance predictions for LED packages
|
van Driel, W.D. |
|
2016 |
62 |
C |
p. 39-44 6 p. |
article |
16 |
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging
|
Adli, A.R. Rezaie |
|
2016 |
62 |
C |
p. 26-38 13 p. |
article |
17 |
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
|
Fellner, Klaus |
|
2016 |
62 |
C |
p. 148-155 8 p. |
article |
18 |
Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices
|
Barink, M. |
|
2016 |
62 |
C |
p. 45-49 5 p. |
article |
19 |
Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters
|
Batunlu, C. |
|
2016 |
62 |
C |
p. 82-90 9 p. |
article |
20 |
Reliability analysis of spin transfer torque based look up tables under process variations and NBTI aging
|
Kuttappa, Ragh |
|
2016 |
62 |
C |
p. 156-166 11 p. |
article |
21 |
Splitter plate application on the circular and square pin fin heat sinks
|
Sajedi, R. |
|
2016 |
62 |
C |
p. 91-101 11 p. |
article |
22 |
The effect of annealing temperature on the electronic parameters and carrier transport mechanism of Pt/n-type Ge Schottky diode
|
Guo, Erjuan |
|
2016 |
62 |
C |
p. 63-69 7 p. |
article |
23 |
Thermo-mechanical effects in Majorana type quantum devices
|
Gielen, A.W.J. |
|
2016 |
62 |
C |
p. 50-57 8 p. |
article |
24 |
Using instruction result locality and re-execution to mitigate silent data corruptions
|
Tajary, Alireza |
|
2016 |
62 |
C |
p. 178-190 13 p. |
article |