| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A cross layer approach for efficient thermal management in 3D stacked SoCs
|
Jung, Matthias
|
|
2016
|
61 |
C |
p. 43-47
5 p.
|
artikel
|
| 2 |
A review on the humidity reliability of high power white light LEDs
|
Singh, Preetpal
|
|
2016
|
61 |
C |
p. 129-139
11 p.
|
artikel
|
| 3 |
A step-accurate model for the trapping and release of charge carriers suitable for the transient simulation of analog circuits
|
Habal, Husni
|
|
2016
|
61 |
C |
p. 17-23
7 p.
|
artikel
|
| 4 |
Comparative study of reliability degradation behaviors of LDMOS and LDMOS-SCR ESD protection devices
|
Yu, Zhihui
|
|
2016
|
61 |
C |
p. 111-114
4 p.
|
artikel
|
| 5 |
Comparison of electrical characteristics between AlGaN/GaN and lattice-matched InAlN/GaN heterostructure Schottky barrier diodes
|
Ren, Jian
|
|
2016
|
61 |
C |
p. 82-86
5 p.
|
artikel
|
| 6 |
Compliance current dominates evolution of NiSi2 defect size in Ni/dielectric/Si RRAM devices
|
Mei, Sen
|
|
2016
|
61 |
C |
p. 71-77
7 p.
|
artikel
|
| 7 |
Copper induced synthesis of graphene using amorphous carbon
|
Narula, Udit
|
|
2016
|
61 |
C |
p. 87-90
4 p.
|
artikel
|
| 8 |
Design and optimization of LDMOS-SCR devices with improved ESD protection performance
|
Liang, Hailian
|
|
2016
|
61 |
C |
p. 115-119
5 p.
|
artikel
|
| 9 |
Early degradation of high power packaged LEDs under humid conditions and its recovery — Myth of reliability rejuvenation
|
Singh, Preetpal
|
|
2016
|
61 |
C |
p. 145-153
9 p.
|
artikel
|
| 10 |
Editorial
|
Asenov, Asen
|
|
2016
|
61 |
C |
p. 1-2
2 p.
|
artikel
|
| 11 |
Editorial Board
|
|
|
2016
|
61 |
C |
p. IFC-
1 p.
|
artikel
|
| 12 |
Effects of thermal annealing on the charge localization characteristics of HfO2/Au/HfO2 stack
|
Feng, Xuan
|
|
2016
|
61 |
C |
p. 78-81
4 p.
|
artikel
|
| 13 |
Electrical properties of carbon nanotube via interconnects for 30nm linewidth and beyond
|
Vyas, Anshul A.
|
|
2016
|
61 |
C |
p. 35-42
8 p.
|
artikel
|
| 14 |
FinFET-based product performance: Modeling and evaluation of standard cells in FinFET technologies
|
Karapetyan, Shushanik
|
|
2016
|
61 |
C |
p. 30-34
5 p.
|
artikel
|
| 15 |
Impact of temperature on linearity and harmonic distortion characteristics of underlapped FinFET
|
Dutta, Arka
|
|
2016
|
61 |
C |
p. 99-105
7 p.
|
artikel
|
| 16 |
Influence of channel length and high-K oxide thickness on subthreshold analog/RF performance of graded channel and gate stack DG-MOSFETs
|
Swain, Sanjit Kumar
|
|
2016
|
61 |
C |
p. 24-29
6 p.
|
artikel
|
| 17 |
Investigation on LDMOS-SCR with high holding current for high voltage ESD protection
|
Liang, Hailian
|
|
2016
|
61 |
C |
p. 120-124
5 p.
|
artikel
|
| 18 |
MPSoC application resilience by hardware-assisted communication virtualization
|
Rösch, S.
|
|
2016
|
61 |
C |
p. 11-16
6 p.
|
artikel
|
| 19 |
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation
|
Chan, Marvin
|
|
2016
|
61 |
C |
p. 56-63
8 p.
|
artikel
|
| 20 |
Numerical study of microbump failure in 3D microelectronic structures
|
Shen, Y.-L.
|
|
2016
|
61 |
C |
p. 48-55
8 p.
|
artikel
|
| 21 |
Reliability enhancement of zinc oxide varistors using sputtered silver electrodes
|
Jin, Hao
|
|
2016
|
61 |
C |
p. 91-94
4 p.
|
artikel
|
| 22 |
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis
|
Che, Fa Xing
|
|
2016
|
61 |
C |
p. 64-70
7 p.
|
artikel
|
| 23 |
Simulation and evaluation of the peak temperature in LED light bulb heatsink
|
Sun, Lixia
|
|
2016
|
61 |
C |
p. 140-144
5 p.
|
artikel
|
| 24 |
Stress in three-dimensionally integrated sensor systems
|
Filipovic, Lado
|
|
2016
|
61 |
C |
p. 3-10
8 p.
|
artikel
|
| 25 |
The variation of the leakage current characteristics of W/Ta2O5/W MIM capacitors with the thickness of the bottom W electrode
|
Yu, D.Q.
|
|
2016
|
61 |
C |
p. 95-98
4 p.
|
artikel
|
| 26 |
300-V class power n-channel LDMOS transistor implemented in 0.18-μm silicon-on-insulator (SOI) technology
|
Zhang, Shuai
|
|
2016
|
61 |
C |
p. 125-128
4 p.
|
artikel
|
| 27 |
Very small snapback silicon-controlled rectifier for electrostatic discharge protection in 28nm processing
|
Wang, Weihuai
|
|
2016
|
61 |
C |
p. 106-110
5 p.
|
artikel
|
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