| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime
|
Gomes, H.L.
|
|
2015
|
55 |
8 |
p. 1192-1195
4 p.
|
artikel
|
| 2 |
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs
|
Yu, Xinhai
|
|
2015
|
55 |
8 |
p. 1174-1179
6 p.
|
artikel
|
| 3 |
A novel stability and process sensitivity driven model for optimal sized FinFET based SRAM
|
Yadav, Nandakishor
|
|
2015
|
55 |
8 |
p. 1131-1143
13 p.
|
artikel
|
| 4 |
Crosstalk bandwidth and stability analysis in graphene nanoribbon interconnects
|
Bagheri, Amin
|
|
2015
|
55 |
8 |
p. 1262-1268
7 p.
|
artikel
|
| 5 |
Degradation mapping in high power IGBT modules using four-point probing
|
Pedersen, Kristian Bonderup
|
|
2015
|
55 |
8 |
p. 1196-1204
9 p.
|
artikel
|
| 6 |
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive
|
Harr, Kyoung-Moo
|
|
2015
|
55 |
8 |
p. 1241-1247
7 p.
|
artikel
|
| 7 |
3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment
|
Zhang, Jin-xin
|
|
2015
|
55 |
8 |
p. 1180-1186
7 p.
|
artikel
|
| 8 |
Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire
|
Tseng, Yi-Wei
|
|
2015
|
55 |
8 |
p. 1256-1261
6 p.
|
artikel
|
| 9 |
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints
|
Hu, Tianwei
|
|
2015
|
55 |
8 |
p. 1226-1233
8 p.
|
artikel
|
| 10 |
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence
|
Gousseau, Simon
|
|
2015
|
55 |
8 |
p. 1205-1213
9 p.
|
artikel
|
| 11 |
Fabrication and characterization of low-cost ultrathin flexible polyimide interposer
|
Huang, Yu-Jung
|
|
2015
|
55 |
8 |
p. 1248-1255
8 p.
|
artikel
|
| 12 |
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints
|
Qin, H.B.
|
|
2015
|
55 |
8 |
p. 1214-1225
12 p.
|
artikel
|
| 13 |
Impact of defect on I(V) instabilities observed on Ti/4H–SiC high voltage Schottky diodes
|
Abdelwahed, N.
|
|
2015
|
55 |
8 |
p. 1169-1173
5 p.
|
artikel
|
| 14 |
Inside front cover - Editorial board
|
|
|
2015
|
55 |
8 |
p. IFC-
1 p.
|
artikel
|
| 15 |
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
|
Liu, Yang
|
|
2015
|
55 |
8 |
p. 1234-1240
7 p.
|
artikel
|
| 16 |
Investigation of geometry dependence on MOSFET linearity in the impact ionization region using Volterra series
|
Lee, Chie-In
|
|
2015
|
55 |
8 |
p. 1163-1168
6 p.
|
artikel
|
| 17 |
Performance of commercial foundry-level AlGaN/GaN HEMTs after hot electron stressing
|
Poling, B.S.
|
|
2015
|
55 |
8 |
p. 1187-1191
5 p.
|
artikel
|
| 18 |
The device characteristics of missing LDD implantation via nanoprobing techniques for localized failure analysis
|
Lai, LiLung
|
|
2015
|
55 |
8 |
p. 1144-1151
8 p.
|
artikel
|
| 19 |
Workload and temperature dependent evaluation of BTI-induced lifetime degradation in digital circuits
|
Eghbalkhah, Behzad
|
|
2015
|
55 |
8 |
p. 1152-1162
11 p.
|
artikel
|
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