| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Adhesion work analysis through molecular modeling and wetting angle measurement
|
Król, Dawid Jan
|
|
2015
|
55 |
5 |
p. 758-764
7 p.
|
article
|
| 2 |
Assessment of long term reliability of photovoltaic glass–glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis
|
Kraemer, F.
|
|
2015
|
55 |
5 |
p. 716-721
6 p.
|
article
|
| 3 |
Computationally efficient and stable order reduction methods for a large-scale model of MEMS piezoelectric energy harvester
|
Kudryavtsev, M.
|
|
2015
|
55 |
5 |
p. 747-757
11 p.
|
article
|
| 4 |
Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction
|
Watzke, S.
|
|
2015
|
55 |
5 |
p. 733-737
5 p.
|
article
|
| 5 |
Diamond layout style impact on SOI MOSFET in high temperature environment
|
Gimenez, Salvador Pinillos
|
|
2015
|
55 |
5 |
p. 783-788
6 p.
|
article
|
| 6 |
Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristics
|
Moon, Pyung
|
|
2015
|
55 |
5 |
p. 795-798
4 p.
|
article
|
| 7 |
Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics
|
Eun, Kyoungtae
|
|
2015
|
55 |
5 |
p. 838-845
8 p.
|
article
|
| 8 |
Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL test
|
Zhang, Lei
|
|
2015
|
55 |
5 |
p. 799-806
8 p.
|
article
|
| 9 |
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur
|
|
2015
|
55 |
5 |
p. 713-715
3 p.
|
article
|
| 10 |
Inside front cover - Editorial board
|
|
|
2015
|
55 |
5 |
p. IFC-
1 p.
|
article
|
| 11 |
Life test of an X-band MMIC multi-function chip for active phased array radar applications
|
Jeong, Jin-Cheol
|
|
2015
|
55 |
5 |
p. 815-821
7 p.
|
article
|
| 12 |
Low-power MicroVrms noise neural spike detector for implantable interface microsystem device
|
Li, Hongge
|
|
2015
|
55 |
5 |
p. 807-814
8 p.
|
article
|
| 13 |
Mechanical stress field assisted charge de-trapping in carbon doped oxides
|
Alam, M.T.
|
|
2015
|
55 |
5 |
p. 846-851
6 p.
|
article
|
| 14 |
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
|
Nabiollahi, Nabi
|
|
2015
|
55 |
5 |
p. 765-770
6 p.
|
article
|
| 15 |
Multiphysics modeling approach for micro electro–thermo–mechanical actuator: Failure mechanisms coupled analysis
|
Wang, Jinling
|
|
2015
|
55 |
5 |
p. 771-782
12 p.
|
article
|
| 16 |
[No title]
|
Gan, Chong Leong
|
|
2015
|
55 |
5 |
p. 852-
1 p.
|
article
|
| 17 |
Potentiality of trap charge effects and SiON induced interface defects in a-Si3N4/SiON based MIS structure for resistive NVM device
|
Dinara, Syed Mukulika
|
|
2015
|
55 |
5 |
p. 789-794
6 p.
|
article
|
| 18 |
Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth
|
Doudrick, Kyle
|
|
2015
|
55 |
5 |
p. 832-837
6 p.
|
article
|
| 19 |
Thermal resistance of side by side multi-chip package: Thermal mode analysis
|
Chen, Dao-Long
|
|
2015
|
55 |
5 |
p. 822-831
10 p.
|
article
|
| 20 |
Thermo-mechanical characterization of passive stress sensors in Si interposer
|
Vianne, Benjamin
|
|
2015
|
55 |
5 |
p. 738-746
9 p.
|
article
|
| 21 |
The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules
|
Edwards, Michael
|
|
2015
|
55 |
5 |
p. 722-732
11 p.
|
article
|
Journal description