nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Adhesion work analysis through molecular modeling and wetting angle measurement
|
Król, Dawid Jan |
|
2015 |
55 |
5 |
p. 758-764 7 p. |
artikel |
2 |
Assessment of long term reliability of photovoltaic glass–glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis
|
Kraemer, F. |
|
2015 |
55 |
5 |
p. 716-721 6 p. |
artikel |
3 |
Computationally efficient and stable order reduction methods for a large-scale model of MEMS piezoelectric energy harvester
|
Kudryavtsev, M. |
|
2015 |
55 |
5 |
p. 747-757 11 p. |
artikel |
4 |
Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction
|
Watzke, S. |
|
2015 |
55 |
5 |
p. 733-737 5 p. |
artikel |
5 |
Diamond layout style impact on SOI MOSFET in high temperature environment
|
Gimenez, Salvador Pinillos |
|
2015 |
55 |
5 |
p. 783-788 6 p. |
artikel |
6 |
Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristics
|
Moon, Pyung |
|
2015 |
55 |
5 |
p. 795-798 4 p. |
artikel |
7 |
Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics
|
Eun, Kyoungtae |
|
2015 |
55 |
5 |
p. 838-845 8 p. |
artikel |
8 |
Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL test
|
Zhang, Lei |
|
2015 |
55 |
5 |
p. 799-806 8 p. |
artikel |
9 |
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur |
|
2015 |
55 |
5 |
p. 713-715 3 p. |
artikel |
10 |
Inside front cover - Editorial board
|
|
|
2015 |
55 |
5 |
p. IFC- 1 p. |
artikel |
11 |
Life test of an X-band MMIC multi-function chip for active phased array radar applications
|
Jeong, Jin-Cheol |
|
2015 |
55 |
5 |
p. 815-821 7 p. |
artikel |
12 |
Low-power MicroVrms noise neural spike detector for implantable interface microsystem device
|
Li, Hongge |
|
2015 |
55 |
5 |
p. 807-814 8 p. |
artikel |
13 |
Mechanical stress field assisted charge de-trapping in carbon doped oxides
|
Alam, M.T. |
|
2015 |
55 |
5 |
p. 846-851 6 p. |
artikel |
14 |
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
|
Nabiollahi, Nabi |
|
2015 |
55 |
5 |
p. 765-770 6 p. |
artikel |
15 |
Multiphysics modeling approach for micro electro–thermo–mechanical actuator: Failure mechanisms coupled analysis
|
Wang, Jinling |
|
2015 |
55 |
5 |
p. 771-782 12 p. |
artikel |
16 |
[No title]
|
Gan, Chong Leong |
|
2015 |
55 |
5 |
p. 852- 1 p. |
artikel |
17 |
Potentiality of trap charge effects and SiON induced interface defects in a-Si3N4/SiON based MIS structure for resistive NVM device
|
Dinara, Syed Mukulika |
|
2015 |
55 |
5 |
p. 789-794 6 p. |
artikel |
18 |
Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth
|
Doudrick, Kyle |
|
2015 |
55 |
5 |
p. 832-837 6 p. |
artikel |
19 |
Thermal resistance of side by side multi-chip package: Thermal mode analysis
|
Chen, Dao-Long |
|
2015 |
55 |
5 |
p. 822-831 10 p. |
artikel |
20 |
Thermo-mechanical characterization of passive stress sensors in Si interposer
|
Vianne, Benjamin |
|
2015 |
55 |
5 |
p. 738-746 9 p. |
artikel |
21 |
The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules
|
Edwards, Michael |
|
2015 |
55 |
5 |
p. 722-732 11 p. |
artikel |