| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fault tolerant implementation of the Goertzel algorithm
|
Gao, Z.
|
|
2014
|
54 |
1 |
p. 335-337
3 p.
|
artikel
|
| 2 |
A generalized modular redundancy scheme for enhancing fault tolerance of combinational circuits
|
El-Maleh, Aiman H.
|
|
2014
|
54 |
1 |
p. 316-326
11 p.
|
artikel
|
| 3 |
Analytical model for threshold voltage of double gate bilayer graphene field effect transistors
|
Saeidmanesh, M.
|
|
2014
|
54 |
1 |
p. 44-48
5 p.
|
artikel
|
| 4 |
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices
|
Zhang, Liang
|
|
2014
|
54 |
1 |
p. 281-286
6 p.
|
artikel
|
| 5 |
An 8-level 3-bit cell programming technique in NOR-type nano-scaled SONOS memory devices
|
Xu, Yue
|
|
2014
|
54 |
1 |
p. 331-334
4 p.
|
artikel
|
| 6 |
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules
|
Musallam, Mahera
|
|
2014
|
54 |
1 |
p. 172-181
10 p.
|
artikel
|
| 7 |
A procedure for assessing the reliability of short circuited concentration photovoltaic systems in outdoor degradation conditions
|
Fucci, Raffaele
|
|
2014
|
54 |
1 |
p. 182-187
6 p.
|
artikel
|
| 8 |
A study of the interface-trap activation kinetics in the Negative Bias Temperature Instability
|
Alagi, Filippo
|
|
2014
|
54 |
1 |
p. 22-29
8 p.
|
artikel
|
| 9 |
Condition assessment and fault prognostics of microelectromechanical systems
|
Medjaher, K.
|
|
2014
|
54 |
1 |
p. 143-151
9 p.
|
artikel
|
| 10 |
Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire
|
Kim, Dae-Suk
|
|
2014
|
54 |
1 |
p. 131-137
7 p.
|
artikel
|
| 11 |
Design optimization of SiGe BiCMOS Silicon Controlled Rectifier for Charged Device Model (CDM) protection applications
|
Cui, Qiang
|
|
2014
|
54 |
1 |
p. 57-63
7 p.
|
artikel
|
| 12 |
3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials
|
Belhenini, Soufyane
|
|
2014
|
54 |
1 |
p. 13-21
9 p.
|
artikel
|
| 13 |
Effect of binding force between silver paste and silicon on power degradation of crystalline silicon solar module
|
Yang, Hong
|
|
2014
|
54 |
1 |
p. 188-191
4 p.
|
artikel
|
| 14 |
Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface
|
Shen, Jun
|
|
2014
|
54 |
1 |
p. 252-258
7 p.
|
artikel
|
| 15 |
Effects of Cu on the interfacial reactions between Sn–8Zn–3Bi–xCu solders and Cu substrate
|
Liu, Lijuan
|
|
2014
|
54 |
1 |
p. 259-264
6 p.
|
artikel
|
| 16 |
Efficient implementation of error correction codes in hash tables
|
Reviriego, P.
|
|
2014
|
54 |
1 |
p. 338-340
3 p.
|
artikel
|
| 17 |
Endurance behavior of conductive yarns
|
de Vries, Hans
|
|
2014
|
54 |
1 |
p. 327-330
4 p.
|
artikel
|
| 18 |
Failure of the negative voltage regulator in medium-photon-energy X radiation fields
|
Vukić, Vladimir Dj.
|
|
2014
|
54 |
1 |
p. 79-89
11 p.
|
artikel
|
| 19 |
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
|
Ekpu, Mathias
|
|
2014
|
54 |
1 |
p. 239-244
6 p.
|
artikel
|
| 20 |
Formation and growth of interfacial intermetallic layers of Sn–8Zn–3Bi–0.3Cr on Cu, Ni and Ni–W substrates
|
Liang, Jiaxing
|
|
2014
|
54 |
1 |
p. 245-251
7 p.
|
artikel
|
| 21 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
1 |
p. IFC-
1 p.
|
artikel
|
| 22 |
Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free solders with Alloy 42 substrate
|
Yen, Yee-Wen
|
|
2014
|
54 |
1 |
p. 233-238
6 p.
|
artikel
|
| 23 |
Investigation of the threshold voltage turn-around effect in long-channel n-MOSFETs due to hot-carrier stress
|
Starkov, I.A.
|
|
2014
|
54 |
1 |
p. 33-36
4 p.
|
artikel
|
| 24 |
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
|
Yazdan Mehr, M.
|
|
2014
|
54 |
1 |
p. 138-142
5 p.
|
artikel
|
| 25 |
Measurement and analysis of substrate leakage current of RF mems capacitive switches
|
Zhu, Y.Q.
|
|
2014
|
54 |
1 |
p. 152-159
8 p.
|
artikel
|
| 26 |
Metal-layer capacitors in the 65nm CMOS process and the application for low-leakage power-rail ESD clamp circuit
|
Chiu, Po-Yen
|
|
2014
|
54 |
1 |
p. 64-70
7 p.
|
artikel
|
| 27 |
Microstructure, shear strength, and nanoindentation property of electroplated Sn–Bi micro-bumps
|
Roh, Myong-Hoon
|
|
2014
|
54 |
1 |
p. 265-271
7 p.
|
artikel
|
| 28 |
Numerical investigation of characteristics of wick structure and working fluid of U-shape heat pipe for CPU cooling
|
Elnaggar, Mohamed H.A.
|
|
2014
|
54 |
1 |
p. 297-302
6 p.
|
artikel
|
| 29 |
Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method
|
Yeh, Jun-Hsien
|
|
2014
|
54 |
1 |
p. 287-296
10 p.
|
artikel
|
| 30 |
Power amplifier resilient design for process and temperature variations using an on-chip PLL sensing signal
|
Yuan, J.S.
|
|
2014
|
54 |
1 |
p. 167-171
5 p.
|
artikel
|
| 31 |
PVT variations aware low leakage INDEP approach for nanoscale CMOS circuits
|
Sharma, Vijay Kumar
|
|
2014
|
54 |
1 |
p. 90-99
10 p.
|
artikel
|
| 32 |
Quality assessment of ZnO-based varistors by 1/f noise
|
Hasse, Lech Z.
|
|
2014
|
54 |
1 |
p. 192-199
8 p.
|
artikel
|
| 33 |
Random vibration reliability of BGA lead-free solder joint
|
Liu, Fang
|
|
2014
|
54 |
1 |
p. 226-232
7 p.
|
artikel
|
| 34 |
Reliability and lifetime modeling of wireless sensor nodes
|
Wang, Chaonan
|
|
2014
|
54 |
1 |
p. 160-166
7 p.
|
artikel
|
| 35 |
Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors
|
Putaala, Jussi
|
|
2014
|
54 |
1 |
p. 272-280
9 p.
|
artikel
|
| 36 |
Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications
|
Salahouelhadj, A.
|
|
2014
|
54 |
1 |
p. 204-213
10 p.
|
artikel
|
| 37 |
Reliable CMOS adaptive equalizer for short-haul optical networks
|
Gimeno, Cecilia
|
|
2014
|
54 |
1 |
p. 110-118
9 p.
|
artikel
|
| 38 |
RPATS – Reliable power aware time synchronization protocol
|
Kosanovic, Mirko R.
|
|
2014
|
54 |
1 |
p. 303-315
13 p.
|
artikel
|
| 39 |
SCR-based transient detection circuit for on-chip protection design against system-level electrical transient disturbance
|
Ker, Ming-Dou
|
|
2014
|
54 |
1 |
p. 71-78
8 p.
|
artikel
|
| 40 |
Single and dual gate OTFT based robust organic digital design
|
Kumar, Brijesh
|
|
2014
|
54 |
1 |
p. 100-109
10 p.
|
artikel
|
| 41 |
Some aspects on ruggedness of SiC power devices
|
Lutz, Josef
|
|
2014
|
54 |
1 |
p. 49-56
8 p.
|
artikel
|
| 42 |
Temperature dependent subthreshold model of long channel GAA MOSFET including localized charges to study variations in its temperature sensitivity
|
Gautam, Rajni
|
|
2014
|
54 |
1 |
p. 37-43
7 p.
|
artikel
|
| 43 |
The influence of electroless metallization process parameters on basic electric properties of Ni–P alloy
|
Pruszowski, Z.
|
|
2014
|
54 |
1 |
p. 200-203
4 p.
|
artikel
|
| 44 |
The promising multi-bit/level programming operations for nano-scaled SONOS memory
|
Ji, Xiao-li
|
|
2014
|
54 |
1 |
p. 119-123
5 p.
|
artikel
|
| 45 |
Thermal management for high-power photonic crystal light emitting diodes
|
Chen, Yuanyuan
|
|
2014
|
54 |
1 |
p. 124-130
7 p.
|
artikel
|
| 46 |
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications
|
Quintero, P.
|
|
2014
|
54 |
1 |
p. 220-225
6 p.
|
artikel
|
| 47 |
Tin whisker analysis of an automotive engine control unit
|
George, Elviz
|
|
2014
|
54 |
1 |
p. 214-219
6 p.
|
artikel
|
| 48 |
Ultrathin barrier GaN-on-Silicon devices for millimeter wave applications
|
Medjdoub, F.
|
|
2014
|
54 |
1 |
p. 1-12
12 p.
|
artikel
|
| 49 |
Water-enhanced negative bias temperature instability in p-type low temperature polycrystalline silicon thin film transistors
|
Zhang, Meng
|
|
2014
|
54 |
1 |
p. 30-32
3 p.
|
artikel
|
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