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Journal description
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Details for article 14 of 49 found articles
| Title: |
Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface |
| Author: |
Shen, Jun Cao, Zhongming Zhai, Dajun Zhao, Mali He, Peipei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 1 pages 7 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 49 found articles
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