| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Acceleration factor for ageing measurement of dye solar cells
|
Ciammaruchi, Laura
|
|
2013
|
53 |
2 |
p. 279-281
3 p.
|
article
|
| 2 |
Advances in ESD protection for ICs
|
Vassilev, Vesselin
|
|
2013
|
53 |
2 |
p. 183-
1 p.
|
article
|
| 3 |
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging
|
Khor, C.Y.
|
|
2013
|
53 |
2 |
p. 334-347
14 p.
|
article
|
| 4 |
An on-chip sensor to measure and compensate static NBTI-induced degradation in analog circuits
|
Askari, Syed
|
|
2013
|
53 |
2 |
p. 245-253
9 p.
|
article
|
| 5 |
Bias dependence of TID radiation responses of 0.13μm partially depleted SOI NMOSFETs
|
Ning, Bingxu
|
|
2013
|
53 |
2 |
p. 259-264
6 p.
|
article
|
| 6 |
Building-up of system level ESD modeling: Impact of a decoupling capacitance on ESD propagation
|
Monnereau, N.
|
|
2013
|
53 |
2 |
p. 221-228
8 p.
|
article
|
| 7 |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps
|
Zhao, Qinghua
|
|
2013
|
53 |
2 |
p. 321-326
6 p.
|
article
|
| 8 |
Effects of ‘Latent Damage’ on pad cratering: Reduction in life and a potential change in failure mode
|
Raghavan, Venkatesh Arasanipalai
|
|
2013
|
53 |
2 |
p. 303-313
11 p.
|
article
|
| 9 |
Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application
|
Kim, Kil-Ho
|
|
2013
|
53 |
2 |
p. 205-207
3 p.
|
article
|
| 10 |
Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling
|
Tohmyoh, Hironori
|
|
2013
|
53 |
2 |
p. 314-320
7 p.
|
article
|
| 11 |
Experimental evaluation of hot electron reliability on differential Clapp-VCO
|
Jang, S.L.
|
|
2013
|
53 |
2 |
p. 254-258
5 p.
|
article
|
| 12 |
HBM tester waveforms, equivalent circuits, and socket capacitance
|
Maloney, Timothy J.
|
|
2013
|
53 |
2 |
p. 184-189
6 p.
|
article
|
| 13 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
2 |
p. IFC-
1 p.
|
article
|
| 14 |
Interdiffusion at the interface between Sn-based solders and Cu substrate
|
Yang, Yang
|
|
2013
|
53 |
2 |
p. 327-333
7 p.
|
article
|
| 15 |
Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off
|
Zhou, Luowei
|
|
2013
|
53 |
2 |
p. 282-287
6 p.
|
article
|
| 16 |
Numerical analysis of localised charges impact on static and dynamic performance of nanoscale cylindrical surrounding gate MOSFET based CMOS inverter
|
Gautam, Rajni
|
|
2013
|
53 |
2 |
p. 236-244
9 p.
|
article
|
| 17 |
Pitfalls for CDM calibration procedures
|
Smedes, T.
|
|
2013
|
53 |
2 |
p. 190-195
6 p.
|
article
|
| 18 |
PMOS-based power-rail ESD clamp circuit with adjustable holding voltage controlled by ESD detection circuit
|
Yeh, Chih-Ting
|
|
2013
|
53 |
2 |
p. 208-214
7 p.
|
article
|
| 19 |
Secondary ESD clamp circuit for CDM protection of over 6Gbit/s SerDes application in 40nm CMOS
|
Okushima, Mototsugu
|
|
2013
|
53 |
2 |
p. 215-220
6 p.
|
article
|
| 20 |
Stability of pentacene transistors under concomitant influence of water vapor and bias stress
|
Tardy, Jacques
|
|
2013
|
53 |
2 |
p. 274-278
5 p.
|
article
|
| 21 |
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond
|
Fiori, Vincent
|
|
2013
|
53 |
2 |
p. 229-235
7 p.
|
article
|
| 22 |
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
|
Wang, Tong Hong
|
|
2013
|
53 |
2 |
p. 297-302
6 p.
|
article
|
| 23 |
The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET
|
Yeh, Wen-Kuan
|
|
2013
|
53 |
2 |
p. 265-269
5 p.
|
article
|
| 24 |
The wire sag problem in wire bonding technology for semiconductor packaging
|
Kung, Huang-Kuang
|
|
2013
|
53 |
2 |
p. 288-296
9 p.
|
article
|
| 25 |
vfTLP-VTH: A new method for quantifying the effectiveness of ESD protection for the CDM classification test
|
Zhou, Yuanzhong
|
|
2013
|
53 |
2 |
p. 196-204
9 p.
|
article
|
| 26 |
Voltage and current stress induced variations in TiN/HfSi x O y /TiN MIM capacitors
|
Misra, D.
|
|
2013
|
53 |
2 |
p. 270-273
4 p.
|
article
|
Journal description